Ab initio molecular dynamics investigation on hydrogen diffusion behavior in liquid aluminum alloy melts

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-09-24 DOI:10.1016/j.vacuum.2024.113683
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Abstract

In this work, ab initio molecular dynamics (AIMD) simulations under both NVT and NPT ensembles were performed to study the influence of alloying elements of Mg, Fe, Si, Ti, Cu, Zn, F, and Cl on the H diffusion behavior in liquid aluminum melt. It is found that the diffusion coefficient of H simulated by AIMD under the NVT model is highly consistent with the reported experimental results. Specifically, the addition of Cu, Cl, Si, and Zn is inclined to increase the diffusion coefficient of H in the melt, whereas the opposite result is observed with the addition of F, Fe, and Ti. Moreover, it is proved that the H diffusion coefficients are positively correlated with the H-Al bond lengths and the coordination number of H in a constant volume system. The obtained results deepen the understanding of the diffusion of H atoms in Al melts and contribute to the optimization of existing melt purification technologies.
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液态铝合金熔体中氢扩散行为的 Ab initio 分子动力学研究
本研究在 NVT 和 NPT 组合下进行了原子分子动力学模拟(AIMD),以研究 Mg、Fe、Si、Ti、Cu、Zn、F 和 Cl 等合金元素对液态铝熔体中 H 扩散行为的影响。结果发现,在 NVT 模型下,AIMD 模拟的 H 扩散系数与实验结果高度一致。具体来说,添加 Cu、Cl、Si 和 Zn 会增加 H 在熔体中的扩散系数,而添加 F、Fe 和 Ti 则会出现相反的结果。此外,研究还证明,在恒定体积体系中,H 的扩散系数与 H-Al 键长度和 H 的配位数呈正相关。研究结果加深了人们对铝熔体中 H 原子扩散的理解,有助于优化现有的熔体净化技术。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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