{"title":"Rare earth chloride Compositing and multiscale structure lead to high thermoelectric performance in p-type Cu3SbSe4","authors":"","doi":"10.1016/j.vacuum.2024.113712","DOIUrl":null,"url":null,"abstract":"<div><div>Cu<sub>3</sub>SbSe<sub>4</sub> is a promising Te-free p-type thermoelectric material, characterized by earth-abundant, low-cost, and environmentally friendly constituents. Nonetheless, its thermoelectric performance is poor due to its extremely low electrical conductivity (deriving from the low carrier concentration) and high lattice thermal conductivity. Herein, we report a high-performance Cu<sub>3</sub>SbSe<sub>4</sub>-based material by compositing LaCl3 and introducing multiscale structure. The LaCl<sub>3</sub>-composted Cu<sub>3</sub>SbSe<sub>4</sub> forms heterojunctions that facilitate charge accumulation at the interfaces. The redistribution of electrons between the two materials increases the electrical conductivity without damaging the Seebeck coefficient, and thereby significantly improving the power factor to ∼1150 μWm<sup>−1</sup>K<sup>−2</sup> for Cu<sub>3</sub>SbSe<sub>4</sub>-based bulk. Furthermore, the hierarchical architecture defects are induced by LaCl<sub>3</sub> compositing, yielding a minimum <em>κ</em><sub>lat</sub> of ∼0.68 Wm<sup>−1</sup>K<sup>−1</sup> at 673 K. As a consequence, a maximum <em>ZT</em> value of ∼0.90 at 673 K is achieved in the Cu<sub>3</sub>SbSe<sub>4</sub> +2 mol% LaCl<sub>3</sub> sample, representing an 80 % improvement compared to the pristine Cu<sub>3</sub>SbSe<sub>4</sub>.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24007589","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Cu3SbSe4 is a promising Te-free p-type thermoelectric material, characterized by earth-abundant, low-cost, and environmentally friendly constituents. Nonetheless, its thermoelectric performance is poor due to its extremely low electrical conductivity (deriving from the low carrier concentration) and high lattice thermal conductivity. Herein, we report a high-performance Cu3SbSe4-based material by compositing LaCl3 and introducing multiscale structure. The LaCl3-composted Cu3SbSe4 forms heterojunctions that facilitate charge accumulation at the interfaces. The redistribution of electrons between the two materials increases the electrical conductivity without damaging the Seebeck coefficient, and thereby significantly improving the power factor to ∼1150 μWm−1K−2 for Cu3SbSe4-based bulk. Furthermore, the hierarchical architecture defects are induced by LaCl3 compositing, yielding a minimum κlat of ∼0.68 Wm−1K−1 at 673 K. As a consequence, a maximum ZT value of ∼0.90 at 673 K is achieved in the Cu3SbSe4 +2 mol% LaCl3 sample, representing an 80 % improvement compared to the pristine Cu3SbSe4.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.