An optical field regulation method for waterjet-guided laser: Reducing taper and improving deep-processing capability

IF 6.7 2区 材料科学 Q1 ENGINEERING, INDUSTRIAL Journal of Materials Processing Technology Pub Date : 2024-10-15 DOI:10.1016/j.jmatprotec.2024.118637
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Abstract

Waterjet-guided laser (WGL) processing technology has the advantages of low thermal damage, no contact stress and ultra-fine processing. However, the energy distribution of the existing technology in the laminar flow water column is still characterized by Gaussian distribution, which leads to taper effect in the processing of thick plate materials and affects the deep-processing capability. To address these shortcomings, a novel waterjet laser-field regulation (WLR) method is proposed in this paper. Optical simulation and coupling experiments confirm the method's ability to modulate the energy within the waterjet into a circular distribution, which solves the problem of low power density near the surface of the waterjet. Waterjet-guided laser cutting experiments were conducted based on the WLR method, and the taper was significantly reduced compared to the conventional WGL. At a power of 12 W, the taper was reduced from 5.85° to 2.28°, a reduction of 61 %. In terms of processing depth, the WLR method cuts slightly lower groove depths with a low number of cuts, but as the number of cuts increases, the groove depth steadily increases and exceeds that of the conventional WGL. At 500 cuts with a laser power of 20 W, the groove depths obtained by the WLR method increased by 115 % compared to that of the conventional WGL. This study has important implications for the processing of thick materials by waterjet-guided laser.
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用于水刀制导激光的光场调节方法:减小锥度,提高深加工能力
水刀引导激光(WGL)加工技术具有热损伤小、无接触应力和超精细加工等优点。然而,现有技术在层流水柱中的能量分布仍以高斯分布为特征,导致在加工厚板材料时产生锥度效应,影响深加工能力。针对这些不足,本文提出了一种新型水刀激光场调节(WLR)方法。光学模拟和耦合实验证实,该方法能够将水射流内的能量调制成圆形分布,从而解决了水射流表面附近功率密度低的问题。基于 WLR 方法进行了水刀引导激光切割实验,与传统的 WGL 相比,锥度明显减小。在功率为 12 W 时,锥度从 5.85°减小到 2.28°,减小了 61%。就加工深度而言,WLR 方法在切割次数较少的情况下切割的沟槽深度略低,但随着切割次数的增加,沟槽深度稳步增加,并超过了传统的 WGL 方法。在激光功率为 20 W 的情况下,切割 500 次时,WLR 方法获得的沟槽深度比传统 WGL 方法增加了 115%。这项研究对利用水刀引导激光加工厚材料具有重要意义。
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来源期刊
Journal of Materials Processing Technology
Journal of Materials Processing Technology 工程技术-材料科学:综合
CiteScore
12.60
自引率
4.80%
发文量
403
审稿时长
29 days
期刊介绍: The Journal of Materials Processing Technology covers the processing techniques used in manufacturing components from metals and other materials. The journal aims to publish full research papers of original, significant and rigorous work and so to contribute to increased production efficiency and improved component performance. Areas of interest to the journal include: • Casting, forming and machining • Additive processing and joining technologies • The evolution of material properties under the specific conditions met in manufacturing processes • Surface engineering when it relates specifically to a manufacturing process • Design and behavior of equipment and tools.
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