Junru Wang, Guoxiang Xia, Longquan Xia, Yunfeng Chen, Qinyuan Li, Hong Zeng, Weiguo Yang, Yongjie Du, Wei He, Yuanming Chen
{"title":"HCNT/AgNPs/PVA/PAM hydrogel-based flexible pressure sensor for physiological monitoring","authors":"Junru Wang, Guoxiang Xia, Longquan Xia, Yunfeng Chen, Qinyuan Li, Hong Zeng, Weiguo Yang, Yongjie Du, Wei He, Yuanming Chen","doi":"10.1007/s10854-024-13689-9","DOIUrl":null,"url":null,"abstract":"<div><p>Flexible wearable devices for health monitoring require continuous wear throughout the day, making flexible pressure sensors a critical component that has attracted significant attention. Polyacrylamide (PAM) and polyvinyl alcohol (PVA) were used as hydrogel substrate materials to fabricate wearable devices with on-the-go wearability. Helical carbon nanotubes (HCNTs) were employed as conductive fillers, with silver nanoparticles (AgNPs) deposited on their surface to enhance conductivity. The conductive HCNT/AgNPs fillers bonded with the PVA/PAM substrate via metal–hydrogen bonds, metal complexes, and Ag–O bonds. This bonding enhanced the binding strength of the gel and accelerated polymerization. Pressure sensors packaged within the hydrogel exhibited high sensitivity of 0.118 kPa<sup>–1</sup> to minor deformations and high sensitivity of 0.0141 kPa<sup>–1</sup> to regular deformations, providing a flexible pressure sensor with high sensitivity and fast response. This innovation delivers a highly sensitive and fast-responding flexible pressure sensor, paving the way for advanced flexible wearable electronic devices.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13689-9","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Flexible wearable devices for health monitoring require continuous wear throughout the day, making flexible pressure sensors a critical component that has attracted significant attention. Polyacrylamide (PAM) and polyvinyl alcohol (PVA) were used as hydrogel substrate materials to fabricate wearable devices with on-the-go wearability. Helical carbon nanotubes (HCNTs) were employed as conductive fillers, with silver nanoparticles (AgNPs) deposited on their surface to enhance conductivity. The conductive HCNT/AgNPs fillers bonded with the PVA/PAM substrate via metal–hydrogen bonds, metal complexes, and Ag–O bonds. This bonding enhanced the binding strength of the gel and accelerated polymerization. Pressure sensors packaged within the hydrogel exhibited high sensitivity of 0.118 kPa–1 to minor deformations and high sensitivity of 0.0141 kPa–1 to regular deformations, providing a flexible pressure sensor with high sensitivity and fast response. This innovation delivers a highly sensitive and fast-responding flexible pressure sensor, paving the way for advanced flexible wearable electronic devices.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.