{"title":"Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing","authors":"Wangyun Li, Longgen Liu, Feng Chen, Yiqin Xu, Hongbo Qin, Yubing Gong","doi":"10.1007/s10854-024-13692-0","DOIUrl":null,"url":null,"abstract":"<div><p>Influences of shear amplitude and joint height on fatigue lifetime and fracture behavior of Cu/Sn–3.0Ag–0.5Cu/Cu joints with increasing current density were investigated. The results show that fatigue lifetime was shortened with increasing shear amplitude and current density but presented no joint height-dependency. A fatigue lifetime prediction model considering electric current stressing was proposed, and the predicted values were close to the experiment results. Additionally, when the current density increased, the fracture initially occurred in the solder matrix with a ductile mode, then shifted to partial at the solder/IMC layer interface with a ductile–brittle mixed mode, and finally migrated to complete at the solder/IMC layer interface with a brittle mode, showing a prominent ductile-to-brittle transition. These changes were mainly due to the sharply aggravated strain mismatch at the interface.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13692-0","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Influences of shear amplitude and joint height on fatigue lifetime and fracture behavior of Cu/Sn–3.0Ag–0.5Cu/Cu joints with increasing current density were investigated. The results show that fatigue lifetime was shortened with increasing shear amplitude and current density but presented no joint height-dependency. A fatigue lifetime prediction model considering electric current stressing was proposed, and the predicted values were close to the experiment results. Additionally, when the current density increased, the fracture initially occurred in the solder matrix with a ductile mode, then shifted to partial at the solder/IMC layer interface with a ductile–brittle mixed mode, and finally migrated to complete at the solder/IMC layer interface with a brittle mode, showing a prominent ductile-to-brittle transition. These changes were mainly due to the sharply aggravated strain mismatch at the interface.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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