Coupling CPFE-CA simulation for grain refinement in ultrasonic elliptical vibration diamond cutting of polycrystalline Cu

IF 6.7 2区 材料科学 Q1 ENGINEERING, INDUSTRIAL Journal of Materials Processing Technology Pub Date : 2024-10-18 DOI:10.1016/j.jmatprotec.2024.118638
Wenxin Zhang , Zhanfeng Wang , Junjie Zhang
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Abstract

While microstructure evolution is commonly observed in severe plastic deformation of polycrystalline metals, modulating the cutting-induced grain refinement in subsurface of polycrystalline metals is promising for promoting the performance of machined surface. In this study, we demonstrate the effectiveness of applying ultrasonic vibration assistance (UVA) in effectively grain refinement of polycrystalline Cu in ultra-precision diamond cutting by experiments and multiscale coupling simulations. Specifically, ordinary cutting (OC) and ultrasonic elliptical vibration-assisted cutting (UEVC) experiments of polycrystalline Cu are carried out, and subsequent cross-sectional characterizations of microstructure evolution in subsurface by metallurgical microscope and electron backscatter diffraction, as well as instrumented nanoindentation tests, are performed, which jointly demonstrate significantly promoted grain refinement in subsurface and increased machined surface hardness by UVA, due to increased dislocation density that is beneficial for the nucleation and growth of dynamic recrystallization. In particular, the multi-scale coupling of Crystal Plasticity Finite Element (CPFE) simulation and Cellular Automata (CA) method is firstly established for exploring the microstructural evolution during UEVC and OC of polycrystalline Cu, which is capable of elucidating the underlying correlation of grain refinement behavior in subsurface with characteristics of stress and strain fields in cutting area. Furthermore, the influence of amplitude on the propensity of grain refinement is experimentally and theoretically evaluated, which suggests a critical amplitude of 4 μm that leads to a maximum reduction in grain size by 80.9 % and a maximum increase in machined surface hardness by 55.8 % in UEVC from that in OC, because of the mostly pronounced strain accumulation and dislocation activity. The findings reported in this study demonstrate the effectiveness of applying ultrasonic vibration assistance for modulating the grain refinement accompanying strengthening of machined surface in ultra-precision diamond cutting of polycrystalline metals.
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耦合 CPFE-CA 仿真用于多晶铜超声波椭圆振动金刚石切割中的晶粒细化
多晶金属在剧烈塑性变形过程中通常会出现微观结构演变,而调节多晶金属表层下的切削诱导晶粒细化有望提高加工表面的性能。在本研究中,我们通过实验和多尺度耦合模拟证明了在超精密金刚石切削中应用超声波振动辅助(UVA)有效细化多晶铜晶粒的有效性。具体而言,对多晶铜进行了普通切削(OC)和超声椭圆振动辅助切削(UEVC)实验,随后通过金相显微镜和电子反向散射衍射以及仪器纳米压痕测试对次表层的微观结构演变进行了横截面表征,共同证明了 UVA 显著促进了次表层的晶粒细化并提高了加工表面硬度,这是由于位错密度的增加有利于动态再结晶的成核和生长。其中,首次建立了晶体塑性有限元(CPFE)模拟和细胞自动机(CA)方法的多尺度耦合,用于探索多晶铜在 UEVC 和 OC 过程中的微观结构演变,能够阐明次表层晶粒细化行为与切削区域应力场和应变场特征的内在关联。此外,还通过实验和理论评估了振幅对晶粒细化倾向的影响,结果表明 4 μm 的临界振幅可使 UEVC 中的晶粒尺寸最大减小 80.9%,加工表面硬度最大提高 55.8%,而 OC 中的晶粒尺寸减小和提高主要是由于明显的应变积累和位错活动。本研究报告的结果表明,在多晶金属的超精密金刚石切削中,应用超声波振动辅助调节晶粒细化和强化加工表面非常有效。
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来源期刊
Journal of Materials Processing Technology
Journal of Materials Processing Technology 工程技术-材料科学:综合
CiteScore
12.60
自引率
4.80%
发文量
403
审稿时长
29 days
期刊介绍: The Journal of Materials Processing Technology covers the processing techniques used in manufacturing components from metals and other materials. The journal aims to publish full research papers of original, significant and rigorous work and so to contribute to increased production efficiency and improved component performance. Areas of interest to the journal include: • Casting, forming and machining • Additive processing and joining technologies • The evolution of material properties under the specific conditions met in manufacturing processes • Surface engineering when it relates specifically to a manufacturing process • Design and behavior of equipment and tools.
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