Wenhua Yang, Kang Lu, Zhenling Tan, Chao Xie, Zhixiang Huang
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引用次数: 0
Abstract
The broad application of Cu-Cu direct bonding is substantially constrained owing to the propensity of copper to oxidize, coupled with complex processes including elevated bonding temperatures and compulsory protective atmospheres. Glycerol is employed to diminish Cu oxide while concurrently preserving the reduced Cu surface in ambient air. Cu-Cu direct bonding was thus accomplished at a lower temperature range (150 °C–200 °C) in ambient air, leveraging glycerol pretreatment for the reduction and protection. The effectiveness of glycerol in curtailing the surface oxidation of Cu at 200 °C in ambient air was discovered. The bonding strength exhibited a steady increase from 19.5 MPa to 32.6 MPa as the bonding temperature escalated from 150 °C to 200 °C. Furthermore, in the case of bonding at 200 °C, the bonding interface presented a dense, continuous nature with minimal oxide and carbon residue. Concurrently, good electrical properties were observed at the bonding interface.
期刊介绍:
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
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• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive