Chao Dong, Sai Gao, Yulin Liu, Gengji Wang, Jinliang Yin, Mingxing Du
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引用次数: 0
Abstract
This paper investigates gate oxide degradation and its influence on Differential Mode(DM) EMI signals. The study reveals that changes in the parasitic capacitance within the chip, resulting from gate oxide degradation, can modify the amplitude-frequency characteristics of DM EMI signals, leading to unexpected transmission outcomes. This paper subjects SiC MOSFET modules to periodic high-temperature gate bias stress, extracts the spectrum characteristics of DM EMI, and assesses the impact of junction temperature. The analysis explores the impact of gate oxide degradation on low and high frequency DM EMI signals. Experimental results reveal distinct sensitivities of amplitude-frequency characteristics in the DM EMI signals to temperature variations and responses to gate oxide degradation at various frequency bands. The extrapolation of the correlation between the frequency-domain characteristics of the DM EMI signals and the degree of gate oxide degradation introduces a novel approach to evaluate the lifespan of power electronic devices.
期刊介绍：
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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