Solder joints stress analysis and optimization of chip component under shear and tensile load based on orthogonal experimental design and gray correlation analysis
{"title":"Solder joints stress analysis and optimization of chip component under shear and tensile load based on orthogonal experimental design and gray correlation analysis","authors":"","doi":"10.1016/j.microrel.2024.115529","DOIUrl":null,"url":null,"abstract":"<div><div>The solder joint finite element analysis model of the 0201 chip component was established, by carrying out the shear loading and tensile loading finite element analysis respectively, the stress distribution pattern of the solder joint shear stress and tension stress were obtained. A solder joint stress measurement platform for the chip component was built, the solder joint stress measurement for the chip component under shear load was completed, and the accuracy of the simulation analysis results was verified. Selecting the solder joint volume, pad gap height, and pad length as design variables, and taking the maximum shear and tensile stress of the solder joint as the target, 16 groups of different parameter level combinations were designed by orthogonal test method, and combining with gray correlation analysis method, the bi-objective optimization design of shear and tensile stress of chip component solder joints was carried out—the optimal level combination of shear and tensile stress was obtained and verified by simulation. The results show that the influence ranking of maximum shear stress and tensile stress in solder joints of chip component are both pad gap height, pad length, and solder joint volume. The optimal parameter level combination is the solder joint volume of 0.0147mm<span><math><msup><mrow></mrow><mrow><mn>2</mn></mrow></msup></math></span>, pad gap height of 0.05 mm, pad length of 0.35 mm, the maximum shear stress and the maximum tensile stress of the chip component solder joints increase by 44% and 23% respectively after the optimization, enhancing the shear strength and tensile strength of the solder joints in chip component simultaneously.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424002099","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The solder joint finite element analysis model of the 0201 chip component was established, by carrying out the shear loading and tensile loading finite element analysis respectively, the stress distribution pattern of the solder joint shear stress and tension stress were obtained. A solder joint stress measurement platform for the chip component was built, the solder joint stress measurement for the chip component under shear load was completed, and the accuracy of the simulation analysis results was verified. Selecting the solder joint volume, pad gap height, and pad length as design variables, and taking the maximum shear and tensile stress of the solder joint as the target, 16 groups of different parameter level combinations were designed by orthogonal test method, and combining with gray correlation analysis method, the bi-objective optimization design of shear and tensile stress of chip component solder joints was carried out—the optimal level combination of shear and tensile stress was obtained and verified by simulation. The results show that the influence ranking of maximum shear stress and tensile stress in solder joints of chip component are both pad gap height, pad length, and solder joint volume. The optimal parameter level combination is the solder joint volume of 0.0147mm, pad gap height of 0.05 mm, pad length of 0.35 mm, the maximum shear stress and the maximum tensile stress of the chip component solder joints increase by 44% and 23% respectively after the optimization, enhancing the shear strength and tensile strength of the solder joints in chip component simultaneously.
期刊介绍：
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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