Wafer chamfering grinding wheels dressing via dynamic deflection laser beam

Abstract

Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.