Qiang Zhang , YiFan Shan , Ning Wang , Zhen Tian , ChaoTing Liu , Xiang Wu , KeWei Song
{"title":"Numerical investigation on thermohydraulic characteristics in a circle tube with a novel arrangement of ellipsoidal dimples","authors":"Qiang Zhang , YiFan Shan , Ning Wang , Zhen Tian , ChaoTing Liu , Xiang Wu , KeWei Song","doi":"10.1016/j.ijheatfluidflow.2024.109631","DOIUrl":null,"url":null,"abstract":"<div><div>A novel arrangement of ellipsoidal dimples for a circle tube was established to improve the tube’s thermal performance. The impacts of axis ratio and depth of an ellipsoidal dimple with an attack angle of 45° on the thermohydraulic characteristics were numerically studied using the realizable <em>k</em>-<em>ε</em> model in the <em>Re</em> range of 10,000 to 40,000. The research shows that increasing the axis ratio of the ellipsoidal dimple from 4:3 to 6:3 leads to the increase in <em>Nu</em> by 15.83 %-18.4 %, with the corresponding increase in <em>f</em> by 19.03 %-30.76 %. The depth of the ellipsoidal dimple also significantly affects the heat transfer performance and pressure drop of the dimpled tube. When the dimple depth increases from 1 mm to 2 mm, <em>Nu</em> and <em>f</em> increase by up to 30.47 % and 64.12 %, respectively. The maximum performance evaluation criteria of 1.68 is achieved when the dimple depth is 2 mm. The proposed ellipsoidal dimple arrangement significantly improves the heat transfer compared with other arrangements in the open literature. The performance evaluation criteria of the studied model with <em>d</em> = 1.5 mm and <em>a</em>:<em>b</em> = 5:3 is up to 19 % larger than the models reported in the references.</div></div>","PeriodicalId":335,"journal":{"name":"International Journal of Heat and Fluid Flow","volume":"110 ","pages":"Article 109631"},"PeriodicalIF":2.6000,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Heat and Fluid Flow","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0142727X24003564","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
A novel arrangement of ellipsoidal dimples for a circle tube was established to improve the tube’s thermal performance. The impacts of axis ratio and depth of an ellipsoidal dimple with an attack angle of 45° on the thermohydraulic characteristics were numerically studied using the realizable k-ε model in the Re range of 10,000 to 40,000. The research shows that increasing the axis ratio of the ellipsoidal dimple from 4:3 to 6:3 leads to the increase in Nu by 15.83 %-18.4 %, with the corresponding increase in f by 19.03 %-30.76 %. The depth of the ellipsoidal dimple also significantly affects the heat transfer performance and pressure drop of the dimpled tube. When the dimple depth increases from 1 mm to 2 mm, Nu and f increase by up to 30.47 % and 64.12 %, respectively. The maximum performance evaluation criteria of 1.68 is achieved when the dimple depth is 2 mm. The proposed ellipsoidal dimple arrangement significantly improves the heat transfer compared with other arrangements in the open literature. The performance evaluation criteria of the studied model with d = 1.5 mm and a:b = 5:3 is up to 19 % larger than the models reported in the references.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.