Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Reliability Pub Date : 2024-11-16 DOI:10.1016/j.microrel.2024.115549

Shuaifeng Zhao , Weiqi Guo , Shaobin Wang , Weiwei Zhang , Xin Li

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Abstract

This paper aims to investigate the influence of bolt assembly position on the fatigue life characteristics of electronic components under thermal cycling loads. In this study, the parameters of the Unified Creep Plasticity (UCP) constitutive model for 63Sn37Pb solder were determined, along with the actual coefficients of thermal expansion (CTE) for each component within the electronic assembly. A high-precision finite element model (FEM) was developed and validated through temperature cycling tests on printed circuit board (PCB) assemblies. The error between the fatigue life of solder joints obtained from the temperature cycling tests and the FEM simulation was within 1 %. Finally, a thermal cycling simulation analysis was conducted on the PCB assembly under different bolt assembly positions. The simulation results revealed a correlation between the bolt assembly locations and the fatigue life of solder joints. The findings of this study can serve as a reference for future efforts aimed at improving the reliability of solder joints under various assembly conditions.

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螺栓组件中电子元件的热循环可靠性：螺栓位置影响研究

本文旨在研究螺栓装配位置对热循环负载下电子元件疲劳寿命特性的影响。在这项研究中，确定了 63Sn37Pb 焊料的统一蠕变塑性（UCP）构成模型参数，以及电子组件中每个元件的实际热膨胀系数（CTE）。开发了一个高精度有限元模型（FEM），并通过对印刷电路板（PCB）组件的温度循环测试进行了验证。温度循环测试得出的焊点疲劳寿命与有限元模型模拟之间的误差在 1%以内。最后，对不同螺栓装配位置下的印刷电路板组件进行了热循环模拟分析。模拟结果显示，螺栓装配位置与焊点疲劳寿命之间存在相关性。这项研究的结果可为今后旨在提高各种装配条件下焊点可靠性的工作提供参考。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.