{"title":"Analyzing negative differential resistance and capacitive effects in SiOx-based resistive switching devices for security applications","authors":"Raju Vemuri, Saurabh Nagar","doi":"10.1016/j.mejo.2024.106472","DOIUrl":null,"url":null,"abstract":"<div><div>In this work, we analyze the negative differential resistance and capacitive effects in SiO<sub>x</sub>-based resistive switching devices. The cause of the negative differential effect has been investigated through the study of the switching mechanism in the devices. It has been observed that there is a combination of trap-controlled space charge limited conduction and trap-assisted Poole-Frenkel effect in the devices. Trapping and de-trapping of injected electrons in the defects within the silica structure causes the negative differential resistance effect. This characteristic feature can be employed to design chaotic circuits for security applications. In addition, the high electric field developed in the device compared to the applied field during the change of bias voltage from ±5V–0V, results in a capacitor discharge-like effect. This work will be a step forward in achieving the global Sustainable Development Goal of Peace, Justice, and Strong Institutions (SDG 16).</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"154 ","pages":"Article 106472"},"PeriodicalIF":1.9000,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001760","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we analyze the negative differential resistance and capacitive effects in SiOx-based resistive switching devices. The cause of the negative differential effect has been investigated through the study of the switching mechanism in the devices. It has been observed that there is a combination of trap-controlled space charge limited conduction and trap-assisted Poole-Frenkel effect in the devices. Trapping and de-trapping of injected electrons in the defects within the silica structure causes the negative differential resistance effect. This characteristic feature can be employed to design chaotic circuits for security applications. In addition, the high electric field developed in the device compared to the applied field during the change of bias voltage from ±5V–0V, results in a capacitor discharge-like effect. This work will be a step forward in achieving the global Sustainable Development Goal of Peace, Justice, and Strong Institutions (SDG 16).
期刊介绍：
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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