Research on the mechanical and thermal properties of potting adhesive with different fillers of h-BN and MPCM

Abstract

Using packaging materials to reduce contact thermal resistance has become a promising method to solve the problem of insufficient heat dissipation capacity of electronic components. The purpose of this work is to optimize the mechanical and thermodynamic performance of potting adhesive using phase change microcapsules (MPCM) and hexagonal boron nitride nano-powder (h-BN) as thermal conductive fillers. The experimental results indicated that h-BN has a positive effect on the tensile strength of the potting adhesive, with a 7.1 % increase in tensile strength at a mass fraction of 30 %. However, the addition of MPCM will weaken the tensile strength of the potting adhesive. Adding MPCM and h-BN can both effectively improve the thermal conductivity of the potting adhesive: when the filler mass fraction is lower than 20 %, the potting adhesive with MPCM filler exhibits more strengthening capability than h-BN type; while with the continuous increase of filler mass fraction, the thermal conductivity of the potting adhesive with h-BN filler is better. The thermal buffering capacity of the potting adhesive significantly increases with the mass fraction of MPCM, while the effect of h-BN on thermal buffering capacity is not significant. In addition, the addition of h-BN and MPCM significantly improves the temperature uniformity of the potting adhesive.