Insight view of GaAs1−xPx alloy via EPM calculations under temperature: a study on phonons, electronic, and optical properties

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-23 DOI:10.1007/s10854-024-13882-w
Elkenany Brens Elkenany, Hasan B. Albargi, R. Dhahri, A. M. Al-Syadi, M. Abdelgaber, O. A. Alfrnwani
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Abstract

The optical and vibrational properties in GaAs1−xPx alloys have been investigated. The electronic properties in GaAs1−xPx alloys have also been studied. Our calculations incorporate the use of the pseudo-potential technique together with the virtual crystal approximation. To the best of the author’s knowledge, no previous studies have been conducted on such features under temperature for this alloy. There is an acceptable match between the published experimental data which are only accessible for binary parent compounds and the numerical results. It is discovered that the studied characteristics under temperature differ from those of the conventional ternary alloy in most cases. This could offer a wider range of options for enhancing the crystals’ characteristics, which would enhance the functionality of devices made from them.

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通过温度下的 EPM 计算透视 GaAs1-xPx 合金:声子、电子和光学特性研究
研究了 GaAs1-xPx 合金的光学和振动特性。我们还研究了 GaAs1-xPx 合金的电子特性。我们的计算结合使用了伪电位技术和虚拟晶体近似。据作者所知,以前从未对这种合金在温度下的此类特性进行过研究。已公布的实验数据只适用于二元母体化合物,而数值结果与实验数据之间的吻合程度可以接受。研究发现,在大多数情况下,所研究的温度下特性与传统的三元合金不同。这为增强晶体特性提供了更广泛的选择,从而提高了用晶体制造的设备的功能。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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