Detection of matrix cracks in composite laminates using embedded fiber-optic distributed strain sensing

IF 4.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Sensors and Actuators A-physical Pub Date : 2024-11-12 DOI:10.1016/j.sna.2024.116039

Yukino Ikeda , Shin-ichi Takeda , Shinsaku Hisada , Toshio Ogasawara

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Abstract

We used an optical frequency-domain reflectometry fiber Bragg grating (FBG) distributed strain measurement system to detect matrix cracks in carbon fiber-reinforced plastics. Load/unload tests were performed on cross-ply laminates under ambient-, high-, and low-temperature conditions using embedded 100 mm gauge FBG sensors. We measured the strain distributed along the gauge and examined the crack initiation using optical microscopy and soft X-ray inspection. A peak appeared in the distributed strain corresponding to the occurrence of cracks. The strain distribution during crack initiation was calculated in each temperature range via finite element analysis and compared with the measurement results. We determined that the number and location of cracks can be determined by extracting the peaks from the distributed strain. However, the peaks in the distributed strain do not correspond to the occurrence of cracks that are close to each other, warranting a measurement method with a higher strain resolution.

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利用嵌入式光纤分布式应变传感技术检测复合材料层压板中的基体裂纹

我们使用光学频域反射测量光纤布拉格光栅（FBG）分布式应变测量系统来检测碳纤维增强塑料中的基体裂纹。在环境、高温和低温条件下，使用嵌入式 100 毫米量规 FBG 传感器对交叉层压板进行了加载/卸载测试。我们测量了沿量规分布的应变，并使用光学显微镜和软 X 射线检测仪检查了裂纹的产生。分布应变中出现了一个峰值，与裂纹的出现相对应。我们通过有限元分析计算了每个温度范围内裂纹萌发时的应变分布，并与测量结果进行了比较。我们发现，通过提取分布应变的峰值，可以确定裂纹的数量和位置。然而，分布应变的峰值并不对应于相互靠近的裂纹的出现，因此需要采用应变分辨率更高的测量方法。

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...