Insight into the keyhole behaviour and its role on residual stress formation in vacuum electron beam welding of TC4 titanium alloy

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-11-15 DOI:10.1016/j.vacuum.2024.113835
Yu Wan, Laimin Song, Xuyang Zhang, Wenchun Jiang, Xuefang Xie, Xinyue Qi
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Abstract

Electron beam welding (EBW) is the preferred technique for joining TC4 titanium alloy. Accurately characterizing the welding keyhole and residual stress distribution, along with analyzing their formation mechanisms, is of paramount importance for ensuring high reliability of the TC4 EBW structures. In this regard, a “thermal-fluid-metallurgical-mechanical” multi-field coupling numerical method was developed, which was then validated by the vital experiments. The evolution of the keyhole, molten pool temperature, phase volume fraction and residual stresses was then revealed. The influencing mechanism of keyhole on residual stress was explored comprehensively. The results show that metal vapor recoil pressure serves as the primary factor in keyhole formation, while the surface tension promotes keyhole closure. The β-phase in the weld zone undergoes a complete transformation into α′ acicular martensite. Moreover, the maximum longitudinal stress occurs at the weld center, while the transverse stress exhibits a substantial stress gradient along the thickness direction. Increasing the welding power raises the temperature of molten pool. The keyhole depth and width are also enlarged, accompanying by the increase of residual stress, which is expected to offer a theoretical foundation for managing the keyhole and residual stress generated during the EBW of TC4 titanium alloy.
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洞察 TC4 钛合金真空电子束焊接中的锁孔行为及其对残余应力形成的作用
电子束焊接(EBW)是连接 TC4 钛合金的首选技术。准确描述焊接锁孔和残余应力分布,并分析其形成机理,对于确保 TC4 EBW 结构的高可靠性至关重要。为此,我们开发了一种 "热-流体-冶金-机械 "多场耦合数值方法,并通过重要实验进行了验证。研究揭示了键孔、熔池温度、相体积分数和残余应力的演变过程。全面探讨了锁孔对残余应力的影响机理。结果表明,金属蒸汽反冲压力是键孔形成的主要因素,而表面张力则促进了键孔的闭合。焊接区的β相完全转变为α′针状马氏体。此外,最大纵向应力出现在焊接中心,而横向应力沿厚度方向呈现出很大的应力梯度。增加焊接功率会提高熔池温度。这有望为 TC4 钛合金 EBW 焊接过程中产生的锁孔和残余应力的管理提供理论依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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