Machine tool operating vibration prediction based on multi-sensor fusion and LSTM neural network

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Electronics Letters Pub Date : 2024-11-23 DOI:10.1049/ell2.70100
Zhonglou Shi, Jinjie Duan, Faquan Li
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Abstract

This study proposes a machine tool vibration prediction method based on multi-sensor fusion and a long short-term memory (LSTM) network. Machine tool vibration significantly impacts machining quality, surface roughness, dimensional accuracy, and tool wear. By combining deep learning with industrial applications, this method achieves high-precision vibration prediction through multi-sensor data fusion. Data is input into the LSTM model to predict the next moment's vibration. Experimental results demonstrate strong prediction capability for periodic vibrations and machining-specific vibration errors, effectively enhancing machining accuracy.

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基于多传感器融合和 LSTM 神经网络的机床运行振动预测
本研究提出了一种基于多传感器融合和长短期记忆(LSTM)网络的机床振动预测方法。机床振动会严重影响加工质量、表面粗糙度、尺寸精度和刀具磨损。该方法将深度学习与工业应用相结合,通过多传感器数据融合实现了高精度振动预测。数据被输入 LSTM 模型,以预测下一时刻的振动。实验结果表明,该方法对周期性振动和特定加工振动误差具有很强的预测能力,可有效提高加工精度。
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来源期刊
Electronics Letters
Electronics Letters 工程技术-工程:电子与电气
CiteScore
2.70
自引率
0.00%
发文量
268
审稿时长
3.6 months
期刊介绍: Electronics Letters is an internationally renowned peer-reviewed rapid-communication journal that publishes short original research papers every two weeks. Its broad and interdisciplinary scope covers the latest developments in all electronic engineering related fields including communication, biomedical, optical and device technologies. Electronics Letters also provides further insight into some of the latest developments through special features and interviews. Scope As a journal at the forefront of its field, Electronics Letters publishes papers covering all themes of electronic and electrical engineering. The major themes of the journal are listed below. Antennas and Propagation Biomedical and Bioinspired Technologies, Signal Processing and Applications Control Engineering Electromagnetism: Theory, Materials and Devices Electronic Circuits and Systems Image, Video and Vision Processing and Applications Information, Computing and Communications Instrumentation and Measurement Microwave Technology Optical Communications Photonics and Opto-Electronics Power Electronics, Energy and Sustainability Radar, Sonar and Navigation Semiconductor Technology Signal Processing MIMO
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