Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear

Abstract

In the process of diamond wire sawing, the sawing force is produced by wire bow formed by the diamond wire. The wear of the diamond wire during sawing will decrease its ability of removing materials, thereby increasing the wire bow and the sawing force, affecting the quality of the as-sawn wafers and even increasing the risk of wire breakage. Therefore, in order to reduce the risk of wire breakage, it is of great significance to establish a sawing force model considering wear and realize the theoretical prediction and analysis of sawing force. In this paper, different forms of abrasives on the surface of the diamond wire are characterized, and the change of wear rate in sawing is analyzed. Combined with the material removal process, a sawing force model considering wear of the abrasives was founded, and the accuracy of the model was verified by sawing experiments. The sawing force of the wire web under multi-wire processing parameters in the industrial production of photovoltaic monocrystalline silicon wafers was analyzed using the established model. With the increase of wire speed from 1500 m/min to 2700 m/min, the peak value of wire web sawing force gradually decreases from 7.12N/m to 4.47 N/m. With the increase of feeding speed from 1.7 mm/min to 2.9 mm/min, the peak value of wire web sawing force gradually increases from 4.3 N/m to 6.55 N/m. The research results provide guiding significance for diamond wire sawing production.