Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-24 DOI:10.1109/TCPMT.2024.3467120
Ying-Han;Dongrui-Liu;Shujun-Li
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Abstract

The bouncing of the contactor upon closing can cause adhesion of contacts and wear of the contact tips, and these factors directly influence the reliability and electrical longevity of the contactor. In this study, a 3-D interpenetrating Cu-W contact with rhombic dodecahedron (RD) skeleton was fabricated using 3-D printing and infiltration technology; some commercial Cu-W contacts were prepared as comparison. Based on Hertz contact theory and extended theory, combined with the Kelvin-Voigt spring damping model, the principle of energy dissipation in contactor contact collision was analyzed. The Young modulus and damping coefficient of the two types of Cu-W contacts were obtained through stress-strain experiments and damping experiments using an INSTRON 5582 testing machine and a DpV55 shaker. The contact bounce characteristics of the two contact tips under different contactor parameters were obtained using a contact bounce test device and finally validated in practical contactors. The results show that the RD-structured Cu-W contact tip with a higher damping coefficient has more internal friction and better energy absorption when subjected to collision impacts, effectively suppressing contact bounce and exhibiting superior anti-bounce performance, especially at high-speed closings.
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三维互穿铜钨的弹跳抑制研究
接触器合拢时的弹跳会引起触点粘连和触头磨损,这些因素直接影响接触器的可靠性和电气寿命。采用3d打印和渗透技术制备了具有菱形十二面体(RD)骨架的三维互穿Cu-W触点;制备了一些商品铜钨触头作为比较。基于Hertz接触理论和扩展理论,结合Kelvin-Voigt弹簧阻尼模型,分析了接触器接触碰撞中的能量耗散原理。利用INSTRON 5582试验机和DpV55激振器,通过应力应变实验和阻尼实验,获得了两种铜钨触点的杨氏模量和阻尼系数。利用触点弹跳试验装置获得了不同接触器参数下两个触点的触点弹跳特性,并在实际接触器中进行了验证。结果表明:rd结构的Cu-W接触尖端具有较高的阻尼系数,在受到碰撞冲击时具有更大的内摩擦和更好的能量吸收,能够有效抑制接触弹跳,并表现出优异的抗弹跳性能,特别是在高速闭合时。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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Table of Contents IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Table of Contents
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