J. Bourhill;G. Cochet;J. Haumant;V. Vlaminck;A. Manchec;M. E. Tobar;V. Castel
{"title":"Metalized 3-D Printed Plastic Resonator Demonstrating Superconductivity Below 4 K","authors":"J. Bourhill;G. Cochet;J. Haumant;V. Vlaminck;A. Manchec;M. E. Tobar;V. Castel","doi":"10.1109/TCPMT.2024.3487264","DOIUrl":null,"url":null,"abstract":"We report the observation of a superconducting transition in a 3-D printed, metalized plastic device. A cylindrical cavity is 3-D printed from a photosensitive polymer resin and then a 20-\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm layer of tin is deposited. A resonant TE microwave mode at 13.41 GHz is observed to reduce its losses by an order of magnitude once it is cooled below 3.72 K, the superconducting transition temperature of tin, with the mode’s Q-factor increasing from \n<inline-formula> <tex-math>$2.7 \\times 10^{4}$ </tex-math></inline-formula>\n to \n<inline-formula> <tex-math>$4.0 \\times 10^{5}$ </tex-math></inline-formula>\n.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2140-2143"},"PeriodicalIF":3.0000,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10737300/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
We report the observation of a superconducting transition in a 3-D printed, metalized plastic device. A cylindrical cavity is 3-D printed from a photosensitive polymer resin and then a 20-
$\mu $
m layer of tin is deposited. A resonant TE microwave mode at 13.41 GHz is observed to reduce its losses by an order of magnitude once it is cooled below 3.72 K, the superconducting transition temperature of tin, with the mode’s Q-factor increasing from
$2.7 \times 10^{4}$
to
$4.0 \times 10^{5}$
.
期刊介绍：
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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