Challenges and progress in packaging materials for power modules with high operation temperature: Review

Abstract

Power semiconductor modules are increasingly applied in the electrical power conversion system, whose development has been characterized by increasing power density and higher operation (or junction) temperature. However, this development presents additional challenges for the packaging assembly of power modules, especially for the packaging materials since they are inevitably subjected to severe thermal loads. To design and manufacture high operation temperature power modules with excellent performance and reliability, a deep understanding of the effects of high temperature on the microstructure and properties of packaging materials and an awareness of the progress of novel packaging materials suitable for high-temperature conditions are necessary, which however, are still lack of systematic review. In this work, the critical packaging materials for power modules, i.e., bonding wire, on-chip metallization layer, and solder alloys have been discussed with respect to the thermal-related failure modes and the corresponding failure mechanisms analyzed based on microstructure degradation and thermal–mechanical effects. The effects of increasing temperature on the reliability of packaging materials are also introduced. Moreover, solutions for improving the thermal performances of materials, the available optimized heat-resisting materials, and the development direction of packaging materials has been concluded and evaluated.