Evaluating the role of nickel-coated carbon fiber in improving high-temperature capabilities of Sn–3.0Ag–0.5Cu solder joints

Abstract

The study explores the possible application of nickel-coated carbon fiber (Ni@CF) to enhance the high-temperature reliability of Sn–3.0Ag–0.5Cu solder connections. It thoroughly examines the growth behavior of intermetallic compounds (IMC) during high-temperature aging. The research results show that after 192 h of aging at 200 °C, the overall IMC layer thickness was reduced because of the more tortuous grain boundaries of the interfacial IMC in the Ni@CF composite solder joints. Additionally, the incorporation of Ni@CF led to decreasing disparities in hardness and modulus between the solder matrix and IMC near the joining interface and improved solder matrix and substrate compliance. Enhanced high-temperature hardness of composite solder matrix up to 200 °C while maintaining solder joint integrity was observed. The study provides a comprehensive insight into the influence of Ni@CF on interfacial IMC grain structure and the reliability of the composite solder joints in high-temperature environments.