High-Quality SnSe Thin Films for Self-Powered Devices and Multilevel Information Encryption

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Applied Materials & Interfaces Pub Date : 2024-12-21 DOI:10.1021/acsami.4c18795
Zunqian Tang, Xiaoyu Sun, Fangyuan Yu, Jian Wang, Zuoxu Wu, Zirui Zhao, Chong Wang, Jun Mao, Qian Zhang, Feng Cao
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Abstract

As semiconductor technology advances toward miniaturization and portability, thin films with excellent thermoelectric performance have garnered increasing attention, particularly for applications in self-powered devices and temperature-responsive sensors. The high Seebeck coefficient of SnSe thin films makes them promising for temperature sensing, but their poor electrical conductivity limits their potential as thermoelectric generators. In this work, high-quality a-axis oriented SnSe thin films were deposited on quartz substrates by using magnetron sputtering. The substrate temperature was optimized to improve the crystallinity of the SnSe thin film, resulting in larger grain sizes, which subsequently contributes to the improved carrier mobility. The Seebeck coefficient is enhanced while optimizing the electrical conductivity, enabling the SnSe thin film to achieve both excellent sensing and power generation performance. The SnSe film deposited at 673 K exhibits a high power factor of approximately 346 μW m–1 K–2 at 620 K. A temperature-responsive sensing array was developed for multilevel information encryption, showing significant potential for applications in password encryption. The maximum output power density of the optimized thermoelectric generator with six SnSe legs is about 9 W m–2 at a temperature difference of 50 K.

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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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