TGSYOLO: Template-Guidance Siamese Network for SMT Welding Defect Detection

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-04 DOI:10.1109/TCPMT.2024.3491163
Kehao Shi;Chengkai Yu;Yang Cao;Yu Kang;Yunbo Zhao;Lijun Zhao;Zhenyi Xu
{"title":"TGSYOLO: Template-Guidance Siamese Network for SMT Welding Defect Detection","authors":"Kehao Shi;Chengkai Yu;Yang Cao;Yu Kang;Yunbo Zhao;Lijun Zhao;Zhenyi Xu","doi":"10.1109/TCPMT.2024.3491163","DOIUrl":null,"url":null,"abstract":"Surface-mounted technology (SMT) welding defect detection plays a key role in the printed circuit board assembly (PCBA) production process, which affects the use of electronic products and cost. Previous works tend to realize defect detection with only defect samples and they assume that there are sufficient defect samples. However, defect samples are usually difficult to collect in real-life scenarios while enough template samples can be easily obtained. In addition, most existing works carry out defect detection based on benchmarks with simple backgrounds of PCBA, which is not suitable for PCBA with complex structures in modern electronic product manufacturing. To address the above issues, we propose a template-guidance Siamese network based on YOLO for SMT welding defect detection (TGSYOLO), which is deployed on a real SMT automatic optical inspection (AOI) system. First, the two-stream structure is introduced to extract deep features in defect images and template images, in which template features serve as guidance knowledge. Then, a template fusion Transformer (TFT) is proposed to model global features between detect and template features in the low-level stage, which could acquire long-range correlations to force the network to focus on potential defect regions. Next, to avoid the disappearance of tiny defect features during deep feature fusion, a multiscale attention feature pyramid network (MAFPN) is proposed to directly fuse defect semantic information from low-level features, which retains detailed expressions of defects through skip connection and obtains compact fusion features. Furthermore, we collect limited welding defect samples based on more complex PCBA backgrounds than previous works through a real SMT AOI system. Experiments on the limited dataset show that TGSYOLO could reach 0.985 of mAP@0.5, 0.885 of mAP@0.75, and 0.984 of F1, which is 0.008, 0.054, and 0.025 higher than other SOTA methods. Also, generalization experiments on the public DeepPCB show that TGSYOLO could still reach the best with 0.991 of mAP@0.5 and 0.89 of mAP@0.75, which proves that TGSYOLO has good generalization performance.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2391-2404"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10742425/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

Surface-mounted technology (SMT) welding defect detection plays a key role in the printed circuit board assembly (PCBA) production process, which affects the use of electronic products and cost. Previous works tend to realize defect detection with only defect samples and they assume that there are sufficient defect samples. However, defect samples are usually difficult to collect in real-life scenarios while enough template samples can be easily obtained. In addition, most existing works carry out defect detection based on benchmarks with simple backgrounds of PCBA, which is not suitable for PCBA with complex structures in modern electronic product manufacturing. To address the above issues, we propose a template-guidance Siamese network based on YOLO for SMT welding defect detection (TGSYOLO), which is deployed on a real SMT automatic optical inspection (AOI) system. First, the two-stream structure is introduced to extract deep features in defect images and template images, in which template features serve as guidance knowledge. Then, a template fusion Transformer (TFT) is proposed to model global features between detect and template features in the low-level stage, which could acquire long-range correlations to force the network to focus on potential defect regions. Next, to avoid the disappearance of tiny defect features during deep feature fusion, a multiscale attention feature pyramid network (MAFPN) is proposed to directly fuse defect semantic information from low-level features, which retains detailed expressions of defects through skip connection and obtains compact fusion features. Furthermore, we collect limited welding defect samples based on more complex PCBA backgrounds than previous works through a real SMT AOI system. Experiments on the limited dataset show that TGSYOLO could reach 0.985 of mAP@0.5, 0.885 of mAP@0.75, and 0.984 of F1, which is 0.008, 0.054, and 0.025 higher than other SOTA methods. Also, generalization experiments on the public DeepPCB show that TGSYOLO could still reach the best with 0.991 of mAP@0.5 and 0.89 of mAP@0.75, which proves that TGSYOLO has good generalization performance.
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SMT焊接缺陷检测的模板导向暹罗网络
表面贴装技术(SMT)焊接缺陷检测在印制电路板组装(PCBA)生产过程中起着关键作用,影响着电子产品的使用和成本。以往的工作往往只通过缺陷样本来实现缺陷检测,并假设缺陷样本足够。然而,在现实场景中,缺陷样本通常很难收集,而足够的模板样本很容易获得。此外,现有的工作大多是基于PCBA背景简单的基准进行缺陷检测,不适合现代电子产品制造中结构复杂的PCBA。针对上述问题,提出了一种基于YOLO的SMT焊接缺陷检测模板引导Siamese网络(TGSYOLO),并将其应用于实际的SMT自动光学检测(AOI)系统。首先,采用双流结构提取缺陷图像和模板图像中的深层特征,其中模板特征作为指导知识;然后,提出了一种模板融合变压器(TFT),在低级阶段对检测特征和模板特征之间的全局特征进行建模,从而获得远程相关性,迫使网络关注潜在缺陷区域。其次,为了避免在深度特征融合过程中微小缺陷特征的消失,提出了一种多尺度关注特征金字塔网络(MAFPN),直接从底层特征中融合缺陷语义信息,通过跳过连接保留缺陷的详细表达,得到紧凑的融合特征。此外,我们通过一个真实的SMT AOI系统,在更复杂的PCBA背景下收集了有限的焊接缺陷样本。在有限数据集上的实验表明,TGSYOLO在mAP@0.5、mAP@0.75和F1上分别能达到0.985、0.885和0.984,分别比其他SOTA方法高0.008、0.054和0.025。同时,在公开的deepppcb上进行的泛化实验表明,TGSYOLO仍然可以达到最佳效果,分别为0.991 (mAP@0.5)和0.89 (mAP@0.75),证明TGSYOLO具有良好的泛化性能。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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Table of Contents IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Table of Contents
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