Improving the Thermal Stability of Indium Oxide n-Type Field-Effect Transistors by Enhancing Crystallinity through Ultrahigh-Temperature Rapid Thermal Annealing

IF 8.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Applied Materials & Interfaces Pub Date : 2025-01-09 DOI:10.1021/acsami.4c18435
Ching-Shuan Huang, Che-Chi Shih, Wu-Wei Tsai, Wei-Yen Woon, Der-Hsien Lien, Chao-Hsin Chien
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Abstract

Ultrathin indium oxide films show great potential as channel materials of complementary metal oxide semiconductor back-end-of-line transistors due to their high carrier mobility, smooth surface, and low leakage current. However, it has severe thermal stability problems (unstable and negative threshold voltage shifts at high temperatures). In this paper, we clarified how the improved crystallinity of indium oxide by using ultrahigh-temperature rapid thermal O2 annealing could reduce donor-like defects and suppress thermal-induced defects, drastically enhancing thermal stability. Not only does more crystalline indium oxide depict the high stability of threshold voltage in stringent high-temperature test environments and under positive bias, but it also shows much less degradation under forming gas annealing than as-deposited transistors. Furthermore, we also successfully solved the channel length-dependent threshold voltage problem, which is often observed in oxide transistors, by suppressing defects induced by the metal deposition process and metal doping.

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通过超高温快速热处理提高结晶度来改善氧化铟n型场效应晶体管的热稳定性
超薄氧化铟薄膜具有载流子迁移率高、表面光滑、漏电流小等优点,在互补金属氧化物半导体后端线晶体管中具有广阔的应用前景。然而,它有严重的热稳定性问题(在高温下不稳定和负阈值电压偏移)。在本文中,我们阐明了如何利用超高温快速热O2退火提高氧化铟的结晶度,从而减少供体样缺陷并抑制热致缺陷,从而大大提高热稳定性。更多的氧化铟晶体不仅在严格的高温测试环境和正偏压下表现出高的阈值电压稳定性,而且在形成气体退火下也表现出比沉积晶体管少得多的退化。此外,我们还通过抑制金属沉积工艺和金属掺杂引起的缺陷,成功地解决了氧化晶体管中经常观察到的沟道长度依赖阈值电压问题。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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