Research on optical transmittance and electromagnetic shielding effectiveness of TiO2/Cu/TiO2 multilayer film

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-09 DOI:10.1007/s10854-024-14199-4
Linlin Lu, Zhenghua Yang, Jie Xu, Jie Dong
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Abstract

TiO2/Cu/TiO2 multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO2/Cu/TiO2 multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (SET) of TiO2/Cu/TiO2 multilayer film (30/34/30 nm thick) reaches the maximum, and the SET value of the multilayer film exceeds 19 dB.

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TiO2/Cu/TiO2多层膜的透光率及电磁屏蔽性能研究
采用磁控溅射的方法在石英玻璃上制备了TiO2/Cu/TiO2多层膜,研究了Cu膜厚度对TiO2/Cu/TiO2多层膜的电、光学和电磁屏蔽性能的影响。结果表明:随着Cu膜厚度从14 nm增加到34 nm, TiO2/Cu/TiO2多层膜的平方电阻从13.1逐渐减小到3.29 Ω,多层膜的平均可见光透过率从80.2%下降到66.0%。随着Cu膜厚度的增加,TiO2/Cu/TiO2多层膜的电磁屏蔽性能呈上升趋势。TiO2/Cu/TiO2多层膜(30/34/30 nm厚)的总电磁屏蔽效能(SET)达到最大值,其SET值超过19 dB。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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