Effect of Ar ion beam treatment on the interfacial adhesion between a fluorinated ethylene propylene (FEP) film and sputtered Cu

IF 6.3 2区材料科学 Q2 CHEMISTRY, PHYSICAL Applied Surface Science Pub Date : 2025-01-17 DOI:10.1016/j.apsusc.2025.162432

Jun-Yeong Yang, Seunghun Lee, Eun-Yeon Byeon, Joo Young Park, Do-geun Kim, Seungyeon Hong, Sung Hun Lee, Hyo Jung Kim, Sunghoon Jung

{"title":"Effect of Ar ion beam treatment on the interfacial adhesion between a fluorinated ethylene propylene (FEP) film and sputtered Cu","authors":"Jun-Yeong Yang, Seunghun Lee, Eun-Yeon Byeon, Joo Young Park, Do-geun Kim, Seungyeon Hong, Sung Hun Lee, Hyo Jung Kim, Sunghoon Jung","doi":"10.1016/j.apsusc.2025.162432","DOIUrl":null,"url":null,"abstract":"Low-loss flexible copper-clad laminates are required for next-generation ultra-high-frequency communication systems, and fluorinated polymers are one of the good dielectric candidates due to its excellent dielectric properties. However, this necessitates ensuring high adhesion between Cu and the fluorinated polymers that commonly indicate surface inertness. This study investigates the effects of Ar ion beam treatment on the interfacial adhesion between fluorinated ethylene propylene (FEP) films and Cu layers deposited via magnetron sputtering. We increased the accumulated Ar ion dose from 9.8 × 1014 to 8.6 × 1015 ions/cm2, and the maximum peel strength between FEP and Cu was recorded to be 7.4 ± 0.26 N/cm at an ion dose of 5.9 × 1015 ions/cm2 on FEP. Surface characterization revealed that in all samples, the initial delamination occurred within the FEP surface, regardless of the Ar ion dose. Interfacial adhesion of Cu/FEP was attributed to the reinforced mechanical properties of the FEP via increased surface roughness and crystallinity. These findings will contribute to ensuring the reliable interfacial adhesion of Cu/FEP systems for high-frequency communications.","PeriodicalId":247,"journal":{"name":"Applied Surface Science","volume":"27 1","pages":""},"PeriodicalIF":6.3000,"publicationDate":"2025-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Surface Science","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.apsusc.2025.162432","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}

引用次数: 0

Abstract

Low-loss flexible copper-clad laminates are required for next-generation ultra-high-frequency communication systems, and fluorinated polymers are one of the good dielectric candidates due to its excellent dielectric properties. However, this necessitates ensuring high adhesion between Cu and the fluorinated polymers that commonly indicate surface inertness. This study investigates the effects of Ar ion beam treatment on the interfacial adhesion between fluorinated ethylene propylene (FEP) films and Cu layers deposited via magnetron sputtering. We increased the accumulated Ar ion dose from 9.8 × 10¹⁴ to 8.6 × 10¹⁵ ions/cm², and the maximum peel strength between FEP and Cu was recorded to be 7.4 ± 0.26 N/cm at an ion dose of 5.9 × 10¹⁵ ions/cm² on FEP. Surface characterization revealed that in all samples, the initial delamination occurred within the FEP surface, regardless of the Ar ion dose. Interfacial adhesion of Cu/FEP was attributed to the reinforced mechanical properties of the FEP via increased surface roughness and crystallinity. These findings will contribute to ensuring the reliable interfacial adhesion of Cu/FEP systems for high-frequency communications.

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来源期刊

Applied Surface Science 工程技术-材料科学：膜

CiteScore

12.50

自引率

7.50%

发文量

3393

审稿时长

67 days

期刊介绍： Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.