Yue Deng;Fengjuan Wang;Xiangkun Yin;Yuan Yang;Ningmei Yu;Yan Li
{"title":"A High Coupling Coefficient and Symmetric Transformer Based on TSV","authors":"Yue Deng;Fengjuan Wang;Xiangkun Yin;Yuan Yang;Ningmei Yu;Yan Li","doi":"10.1109/TCPMT.2024.3503561","DOIUrl":null,"url":null,"abstract":"Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"165-172"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10758673/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.
期刊介绍：
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
