Zubair Ibrahim, Gul Hassan, Abdullah A. Alatawi, Hathal Salamah Alwageed, Arfa Asif
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引用次数: 0
Abstract
Wearable self-healable strain sensors are gaining significant attention for applications in healthcare, robotics, and human–computer interaction. However, existing sensors face key challenges, including limited healing efficiency, low sensitivity to mechanical strain, and inadequate durability under repeated stress. Addressing these limitations, this study presents a novel strain sensor combining a polyurethane (PU) substrate with magnetic iron oxide nanoparticles (MIONPs) and silver flakes to enhance self-healing capabilities and strain sensitivity. The integration of MIONPs enables a self-healing efficiency of 96.6% within 24 h, a notable improvement over previous technologies that often require longer recovery times and achieve lower healing rates. Additionally, the sensor achieves a high gauge factor of 271.4 at 35% strain, representing a fourfold increase in sensitivity compared to traditional strain sensors. The sensor's responsiveness to external magnetic fields, with a magnetic sensitivity of 0.0049 T⁻1, further expands its application potential in areas like magnetically controlled devices and soft robotics. This work significantly advances multifunctional, self-healing strain sensors by addressing current limitations and offering improved performance for long-term, sustainable applications.
可穿戴式自修复应变传感器在医疗保健、机器人和人机交互领域的应用越来越受到关注。然而,现有的传感器面临着关键的挑战,包括愈合效率有限,对机械应变的敏感度低,以及在重复应力下的耐久性不足。针对这些限制,本研究提出了一种新型应变传感器,将聚氨酯(PU)衬底与磁性氧化铁纳米颗粒(MIONPs)和银片结合在一起,以增强自修复能力和应变灵敏度。MIONPs的集成使其在24小时内的自愈效率达到96.6%,与之前需要更长的恢复时间和更低的愈合率的技术相比,这是一个显着的改进。此外,该传感器在35%应变下达到271.4的高测量系数,与传统应变传感器相比,灵敏度提高了四倍。该传感器对外部磁场的响应能力,磁灵敏度为0.0049 T - 1,进一步扩大了其在磁控设备和软机器人等领域的应用潜力。这项工作通过解决当前的局限性,并为长期、可持续的应用提供改进的性能,显著地推进了多功能、自修复应变传感器的发展。
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.