Fabrication of microwave absorber based on strontium ferrite-titanium carbide composite in thermoset polyurethane matrix

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-17 DOI:10.1007/s10854-024-14158-z

Aarushi Ahlawat, G. D. Tyagi, Sachin Tyagi

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Abstract

In this study, flexible elastomers are developed as microwave absorbers for industrial and defence applications by incorporating strontium ferrite (SrFe₁₂O₁₉) and titanium carbide (TiC) into a thermoset polyurethane (PU) matrix. These samples are characterized for their morphological, structural, and thermal properties employing FE-SEM, FTIR, XRD, and TGA analysis, respectively. The hardness, tensile test, and tear resistance of elastomers are used to determine the mechanical properties. These elastomers are characterized for their microwave absorption properties in X-band frequency region. It exhibits a minimum reflection loss (RL) of − 28.14 dB in the X-band with a bandwidth of 3.5 GHz. The synergistic interaction between magnetic-dielectric phases improves the impedance matching within the thermoset polyurethane elastomer. SrFe₁₂O₁₉-TiC/PU elastomer exhibits excellent thermal, mechanical, and electromagnetic absorption properties, making them ideal for use in microwave absorption applications, including industrial such as anechoic chambers and defence purposes.

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热固性聚氨酯基铁氧体锶-碳化钛复合材料微波吸收体的制备

在这项研究中，将铁氧体锶（SrFe12O19）和碳化钛（TiC）结合到热固性聚氨酯（PU）基体中，开发了柔性弹性体作为工业和国防应用的微波吸收剂。利用FE-SEM、FTIR、XRD和TGA等分析手段对样品的形貌、结构和热性能进行了表征。弹性体的硬度、拉伸试验和抗撕裂性用于确定其机械性能。这些弹性体在x波段具有微波吸收特性。在带宽为3.5 GHz时，x波段的最小反射损耗（RL）为−28.14 dB。磁介电相之间的协同作用改善了热固性聚氨酯弹性体内部的阻抗匹配。SrFe12O19-TiC/PU弹性体具有优异的热，机械和电磁吸收性能，使其成为微波吸收应用的理想选择，包括工业消声室和国防用途。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.