Crack growth in laser powder bed fusion fabricated alloy 718 at 650 °C under static and cyclic loading

IF 6.8 2区 材料科学 Q1 ENGINEERING, MECHANICAL International Journal of Fatigue Pub Date : 2025-04-01 Epub Date: 2025-01-04 DOI:10.1016/j.ijfatigue.2025.108810
Halsey E. Ostergaard , Joshua D. Pribe , M. Tarik Hasib , Thomas Siegmund , Jamie J. Kruzic
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Abstract

The role of microstructure in influencing 650 °C crack growth behavior for laser powder bed fusion (LPBF) fabricated nickel alloy 718 was examined by applying two post-build heat treatments and comparing to wrought material. The first heat treatment (solution and ageing) retained the elongated grain structure along the build direction. The second used hot isostatic pressing (HIP) prior to the solution and aging treatment to mostly recrystallize the microstructure. At high cyclic frequency (30 Hz), crack growth was mixed transgranular and intergranualr and differences in the crack growth rates among samples were primary caused by grain size differences and corresponding transgranular crack path roughness. Under static loading or low frequency (0.1 Hz) cyclic loading, intergranular crack growth dominated. Without HIP, the LPBF material had highly anisotropic behavior with a high threshold for crack extension when the crack plane tried to cut across the elongated grain structure. After HIP, the LPBF fabricated material displayed excellent resistance to intergranular crack extension at both 0.1 Hz and constant applied load due to a large fraction of Σ3 special boundaries which are highly resistant to intergranular oxidation. The results suggest LPBF with HIP treatment can give a grain boundary engineered 718 microstructure for elevated temperature applications.
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静态和循环载荷下激光粉末床熔合718合金650°C的裂纹扩展
采用两种热处理方法,并与变形材料进行对比,研究了显微组织对激光粉末床熔合镍合金718 650℃裂纹扩展行为的影响。第一次热处理(固溶和时效)沿构建方向保留了拉长的晶粒结构。第二种是在固溶和时效处理之前进行热等静压(HIP)处理,使组织大部分再结晶。在高循环频率(30 Hz)下,裂纹扩展为跨晶和跨晶混合扩展,试样间裂纹扩展速率的差异主要是由晶粒尺寸差异和相应的跨晶裂纹路径粗糙度引起的。在静载和低频(0.1 Hz)循环加载下,晶间裂纹扩展占主导地位。在未加入HIP的情况下,LPBF材料具有高度的各向异性,当裂纹平面试图穿过拉长的晶粒结构时,裂纹扩展的阈值很高。经过HIP处理后,LPBF制备的材料在0.1 Hz和恒定载荷下都表现出优异的抗晶间裂纹扩展能力,这是由于大量的Σ3特殊边界具有很高的抗晶间氧化能力。结果表明,在高温应用中,经HIP处理的LPBF可以获得设计好的晶界718显微组织。
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来源期刊
International Journal of Fatigue
International Journal of Fatigue 工程技术-材料科学:综合
CiteScore
10.70
自引率
21.70%
发文量
619
审稿时长
58 days
期刊介绍: Typical subjects discussed in International Journal of Fatigue address: Novel fatigue testing and characterization methods (new kinds of fatigue tests, critical evaluation of existing methods, in situ measurement of fatigue degradation, non-contact field measurements) Multiaxial fatigue and complex loading effects of materials and structures, exploring state-of-the-art concepts in degradation under cyclic loading Fatigue in the very high cycle regime, including failure mode transitions from surface to subsurface, effects of surface treatment, processing, and loading conditions Modeling (including degradation processes and related driving forces, multiscale/multi-resolution methods, computational hierarchical and concurrent methods for coupled component and material responses, novel methods for notch root analysis, fracture mechanics, damage mechanics, crack growth kinetics, life prediction and durability, and prediction of stochastic fatigue behavior reflecting microstructure and service conditions) Models for early stages of fatigue crack formation and growth that explicitly consider microstructure and relevant materials science aspects Understanding the influence or manufacturing and processing route on fatigue degradation, and embedding this understanding in more predictive schemes for mitigation and design against fatigue Prognosis and damage state awareness (including sensors, monitoring, methodology, interactive control, accelerated methods, data interpretation) Applications of technologies associated with fatigue and their implications for structural integrity and reliability. This includes issues related to design, operation and maintenance, i.e., life cycle engineering Smart materials and structures that can sense and mitigate fatigue degradation Fatigue of devices and structures at small scales, including effects of process route and surfaces/interfaces.
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