High-strength Au–Au bonding for temperature and pressure integrated sensor

IF 6.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Materials Research and Technology-Jmr&t Pub Date : 2025-01-16 DOI:10.1016/j.jmrt.2025.01.118
Mimi Huang , Yong Xia , Xiangguang Han , Yi Gao , Shuai Chen , Zeyu Cui , Cheng Zhang , Yushan Gao , Zhixia Qiao , Yang Lv , Xiaowei Hou , Chenying Wang , Ping Yang , Libo Zhao
{"title":"High-strength Au–Au bonding for temperature and pressure integrated sensor","authors":"Mimi Huang ,&nbsp;Yong Xia ,&nbsp;Xiangguang Han ,&nbsp;Yi Gao ,&nbsp;Shuai Chen ,&nbsp;Zeyu Cui ,&nbsp;Cheng Zhang ,&nbsp;Yushan Gao ,&nbsp;Zhixia Qiao ,&nbsp;Yang Lv ,&nbsp;Xiaowei Hou ,&nbsp;Chenying Wang ,&nbsp;Ping Yang ,&nbsp;Libo Zhao","doi":"10.1016/j.jmrt.2025.01.118","DOIUrl":null,"url":null,"abstract":"<div><div>With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O<sub>2</sub> plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.</div></div>","PeriodicalId":54332,"journal":{"name":"Journal of Materials Research and Technology-Jmr&t","volume":"35 ","pages":"Pages 1239-1249"},"PeriodicalIF":6.2000,"publicationDate":"2025-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research and Technology-Jmr&t","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2238785425001188","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O2 plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Materials Research and Technology-Jmr&t
Journal of Materials Research and Technology-Jmr&t Materials Science-Metals and Alloys
CiteScore
8.80
自引率
9.40%
发文量
1877
审稿时长
35 days
期刊介绍: The Journal of Materials Research and Technology is a publication of ABM - Brazilian Metallurgical, Materials and Mining Association - and publishes four issues per year also with a free version online (www.jmrt.com.br). The journal provides an international medium for the publication of theoretical and experimental studies related to Metallurgy, Materials and Minerals research and technology. Appropriate submissions to the Journal of Materials Research and Technology should include scientific and/or engineering factors which affect processes and products in the Metallurgy, Materials and Mining areas.
期刊最新文献
High-strength Au–Au bonding for temperature and pressure integrated sensor Investigation on the fracture toughness of a low-density δ-quenching and partitioning steel sheet Effect of dual-scale precipitates on the deformation behavior of AZ41 magnesium alloy via wire-arc directed energy deposition In-situ SEM analysis of plastic deformation, crack initiation, crack propagation behaviors in M2 high speed steel A review on the anomalous exothermic behavior of bubbles in aluminum induced by electron irradiation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1