High-strength Au–Au bonding for temperature and pressure integrated sensor

IF 7.3 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Materials Research and Technology-Jmr&t Pub Date : 2025-03-01 Epub Date: 2025-01-16 DOI:10.1016/j.jmrt.2025.01.118

Mimi Huang , Yong Xia , Xiangguang Han , Yi Gao , Shuai Chen , Zeyu Cui , Cheng Zhang , Yushan Gao , Zhixia Qiao , Yang Lv , Xiaowei Hou , Chenying Wang , Ping Yang , Libo Zhao

{"title":"High-strength Au–Au bonding for temperature and pressure integrated sensor","authors":"Mimi Huang , Yong Xia , Xiangguang Han , Yi Gao , Shuai Chen , Zeyu Cui , Cheng Zhang , Yushan Gao , Zhixia Qiao , Yang Lv , Xiaowei Hou , Chenying Wang , Ping Yang , Libo Zhao","doi":"10.1016/j.jmrt.2025.01.118","DOIUrl":null,"url":null,"abstract":"<div><div>With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O<sub>2</sub> plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.</div></div>","PeriodicalId":54332,"journal":{"name":"Journal of Materials Research and Technology-Jmr&t","volume":"35 ","pages":"Pages 1239-1249"},"PeriodicalIF":7.3000,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research and Technology-Jmr&t","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2238785425001188","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/1/16 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O₂ plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

用于温度和压力集成传感器的高强度Au-Au键合

随着电子器件智能化和集成化的发展，无引线集成传感器有了广阔的发展前景。在TSV （Through Silicon Via）无铅封装中，最关键的工艺之一是Au-Au键合，其键合强度决定了传感器制备的成败。本研究针对所设计的温度压力集成传感器，研究了结合温度对结合强度的影响。为了进一步提高结合强度，对金属表面进行了等离子体处理。研究了不同等离子体气氛和处理时间对表面形貌、表面亲水性、化学状态和键合速率的影响。并对不同键合条件下的键合界面进行了表征。最后，在450℃、4000 mbar条件下，经过120 s的O2等离子体处理和1 h的粘接，粘接强度提高了68%，达到27 MPa，增强了制备温度压力一体化传感器的可行性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Journal of Materials Research and Technology-Jmr&t Materials Science-Metals and Alloys

CiteScore

8.80

自引率

9.40%

发文量

1877

审稿时长

35 days

期刊介绍： The Journal of Materials Research and Technology is a publication of ABM - Brazilian Metallurgical, Materials and Mining Association - and publishes four issues per year also with a free version online (www.jmrt.com.br). The journal provides an international medium for the publication of theoretical and experimental studies related to Metallurgy, Materials and Minerals research and technology. Appropriate submissions to the Journal of Materials Research and Technology should include scientific and/or engineering factors which affect processes and products in the Metallurgy, Materials and Mining areas.