Comprehensive Electrothermal Characterization Analysis for Scaled Nanochannels in Gate-All-Around Field-Effect Transistors

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Numerical Modelling-Electronic Networks Devices and Fields Pub Date : 2025-01-22 DOI:10.1002/jnm.70017
Ziping Wang, Fei Li, Yabin Sun, Yanling Shi, Xiaoji Li
{"title":"Comprehensive Electrothermal Characterization Analysis for Scaled Nanochannels in Gate-All-Around Field-Effect Transistors","authors":"Ziping Wang,&nbsp;Fei Li,&nbsp;Yabin Sun,&nbsp;Yanling Shi,&nbsp;Xiaoji Li","doi":"10.1002/jnm.70017","DOIUrl":null,"url":null,"abstract":"<div>\n \n <p>Gate-all-around field-effect transistors (GAAFETs) have garnered extensive research interest and industrial attention due to the higher gate control capability and remarkable scalability. However, as the nanochannel scales down, the phonon-boundary scattering inside channels is dramatically strengthened, resulting in a significant decrease in phonon mean free path (MFP), which in turn leads to a decrease in thermal conductivity and deteriorates electrothermal characteristics. In this paper, to accurately evaluate the degradation of thermal conductivity for confined nanochannels, an analytical model is developed by revising the boundary-induced reduction function related to both nanochannel width and thickness. The results show that the thermal conductivity calculated by the proposed model agrees well with the experimental data within 1% error over large temperature range for nanosheet and nanowire structures. Moreover, significant deviations of 6.11% in on-state current and 41.7 K in temperature are observed between the proposed and conventional models for three-stacked GAAFETs. The proposed revised methodology offers invaluable insights for assessing the electrothermal characteristics of nanodevices.</p>\n </div>","PeriodicalId":50300,"journal":{"name":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","volume":"38 1","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/jnm.70017","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

Gate-all-around field-effect transistors (GAAFETs) have garnered extensive research interest and industrial attention due to the higher gate control capability and remarkable scalability. However, as the nanochannel scales down, the phonon-boundary scattering inside channels is dramatically strengthened, resulting in a significant decrease in phonon mean free path (MFP), which in turn leads to a decrease in thermal conductivity and deteriorates electrothermal characteristics. In this paper, to accurately evaluate the degradation of thermal conductivity for confined nanochannels, an analytical model is developed by revising the boundary-induced reduction function related to both nanochannel width and thickness. The results show that the thermal conductivity calculated by the proposed model agrees well with the experimental data within 1% error over large temperature range for nanosheet and nanowire structures. Moreover, significant deviations of 6.11% in on-state current and 41.7 K in temperature are observed between the proposed and conventional models for three-stacked GAAFETs. The proposed revised methodology offers invaluable insights for assessing the electrothermal characteristics of nanodevices.

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来源期刊
CiteScore
4.60
自引率
6.20%
发文量
101
审稿时长
>12 weeks
期刊介绍: Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models. The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics. Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.
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