Theoretical and numerical studies of heat and humidity transfer in underground ventilation corridor

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL International Journal of Heat and Fluid Flow Pub Date : 2025-02-05 DOI:10.1016/j.ijheatfluidflow.2025.109765
Tong Ren , Mengzhuo Li , De Wang , Jia Yang , Lingbo Kong , Long He
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引用次数: 0

Abstract

Corridor ventilation is a crucial measure to provide good air quality for underground buildings, it is necessary to predict and study the variation law of the environment in the corridor. Theoretical analysis and numerical simulation of heat and humidity transfer were carried out and the equations to predict air temperature and moisture content are proposed for the underground corridor. Corridor structure (e.g. cross-section diameter, length) and environmental parameters (e.g. wall temperature, air velocity, inlet air temperature, and relative humidity) are discussed in detail. The corridor structure parameters have been found to have little impact on the cooling and dehumidification effect when the corridor length x/L > 0.1. The inlet air temperature and velocity are the most crucial parameters for the cooling and dehumidification efficiency. The inlet air relative humidity and wall temperature are the main factors of fog formation in the corridor. Therefore, reasonable design and matching of corridor parameters is very important for the environmental control in underground corridors.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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