Quasi-one-dimensional mathematical model of the two-dimensional supersonic cavity mean flow

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL International Journal of Heat and Fluid Flow Pub Date : 2025-03-01 Epub Date: 2025-02-05 DOI:10.1016/j.ijheatfluidflow.2025.109767
Qi Wang , Rui Yang , Yu-xin Zhao , Wei Liu
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Abstract

A novel quasi-one-dimensional mathematical model for time-averaged supersonic cavity flow arising from quasi-one-dimensional analysis is proposed. The fundamental inputs required for the model comprise the primary vortex center position and the aerodynamic parameters of the boundary. Specifically, the primary vortex center position serves to fix the contours of the quasi-one-dimensional model, while the total temperature, density, and velocity of the boundary provide definite conditions for the model. The assumptions regarding the inputs are proposed based on numerical investigation which has been validated through experiments on the n-regular-polygonal cavities. The model helps to reveal the intricate correlations between cavity flow characteristics and cavity geometry, as well as the relationship between cavity flow characteristics and freestream Mach number, and may be used for the prediction of mass flux within the cavity.
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二维超声速腔平均流动的准一维数学模型
在准一维分析的基础上,提出了时间平均超音速空腔流动的准一维数学模型。该模型所需的基本输入包括主涡中心位置和边界的气动参数。其中,主涡中心位置固定了准一维模型的轮廓,而边界的总温度、密度和速度为模型提供了确定的条件。在数值研究的基础上提出了输入的假设,并通过对n正多边形空腔的实验进行了验证。该模型有助于揭示空腔流动特性与空腔几何形状之间的复杂关系,以及空腔流动特性与自由流马赫数之间的关系,并可用于预测空腔内的质量通量。
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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