Effect of universal adhesives and application modes on the bond strength of amalgam-contaminated dentin

IF 3.5 3区 材料科学 Q2 ENGINEERING, CHEMICAL International Journal of Adhesion and Adhesives Pub Date : 2025-03-01 Epub Date: 2025-01-23 DOI:10.1016/j.ijadhadh.2025.103945
Gülşah Tonga, Hüseyin Hatirli, Dorukcan Yildirim
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Abstract

Objective

This study evaluated the bond strength of universal adhesive systems and different application modes for amalgam-contaminated dentin.

Methods

Sixty mandibular third molars were embedded in acrylic resin, and their dentin was exposed. The specimens were divided into amalgam-contaminated dentin (ACD) and uncontaminated dentin (UD) groups. Thirty teeth were restored with amalgam, and aged by thermal cycling and chewing simulation, after which their amalgam was removed. Teeth were assigned to three adhesive groups: G-Premio Bond (Gp), Scotchbond Universal (SB), Clearfil S3 Bond (CS3), and two subgroups: etch-and-rinse (ER) and self-etch (SE) (n = 5). Adhesives were applied in both ER and SE modes, following the manufacturers' instructions. For the ER procedure, the dentin surface was roughened with 37.5 % orthophosphoric acid for 15 s, followed by a water rinse for 15 s. The universal adhesives were then applied according to the manufacturers’ guidelines. Microtensile bond strength (μTBS) was tested immediately or after water aging. Statistical analysis was performed using three-way ANOVA and Bonferroni correction.

Results

Amalgam contamination decreased μTBS in all groups. This effect was significant in Gp-ER/aged, Gp-SE/aged, SB-SE/aged, CS3-ER/aged, CS3-ER/immediate, and CS3-SE/aged groups (p<0.05). Aging protocol decreased μTBS in Gp-ER, CS3-ER, and CS3-SE for UD, and in all except for SB-ER for ACD (p<0.05). Except for the Gp/aged and SB/aged groups, ER application of adhesive agents exhibited higher μTBS values than SE. This value was significant on the UD surface in the Gp/immediate group (p <0.05), while it was significant on the ACD surface in all groups except Gp/aged and SB/immediate groups (p<0.05).

Conclusion

Corrosion products from amalgam restorations reduce adhesive bond strength to dentin. The ER application showed higher bond strength on the ACD and UD surfaces.

Clinical significance

Composite materials are often preferred to replace removed amalgam restorations. Amalgam-contaminated dentin surfaces exposed after failed amalgam restorations are removed in the clinic should be treated differently from uncontaminated dentin surfaces. Adhesive agents and application modes should be selected accordingly for clinical procedures.
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通用胶粘剂及应用方式对汞合金污染牙本质粘结强度的影响
目的评价通用黏合剂系统对汞合金污染牙本质的粘接强度及不同应用方式。方法用丙烯酸树脂包埋60颗下颌第三磨牙,暴露牙本质。将标本分为汞齐污染牙本质组(ACD)和未污染牙本质组(UD)。用汞合金修复30颗牙齿,通过热循环和模拟咀嚼老化,然后去除汞合金。将牙齿分为三组:G-Premio Bond (Gp)、Scotchbond Universal (SB)、Clearfil S3 Bond (CS3),以及两个亚组:蚀刻-冲洗(ER)和自蚀刻(SE) (n = 5)。按照制造商的说明,在ER和SE模式下使用粘合剂。对于内源性牙本质手术,牙本质表面用37.5%的正磷酸磨粗15秒,然后用水冲洗15秒。然后根据制造商的指导方针应用通用粘合剂。分别在水老化后和立即测试微拉伸粘结强度(μTBS)。统计学分析采用三向方差分析和Bonferroni校正。结果三聚氰胺污染使各组的μTBS降低。在Gp-ER/aged、Gp-SE/aged、SB-SE/aged、CS3-ER/aged、CS3-ER/immediate和CS3-SE/age组中,差异均有统计学意义(p < 0.05)。老化方案降低了UD组Gp-ER、CS3-ER和CS3-SE组的μTBS, ACD组除SB-ER组外其余组的μTBS (p < 0.05)。除Gp/age组和SB/age组外,胶粘剂ER的μTBS值均高于SE。该值在Gp/immediate组UD表面显著(p<0.05),在ACD表面除Gp/age组和SB/immediate组外,其余各组均显著(p<0.05)。结论汞合金修复体的腐蚀产物降低了其与牙本质的结合强度。ER在ACD和UD表面的结合强度更高。临床意义复合材料常被用于替代移除的汞合金修复体。在临床移除汞合金修复失败后暴露的被汞合金污染的牙本质表面应与未被污染的牙本质表面区别对待。临床操作中应选择相应的粘接剂和应用方式。
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来源期刊
International Journal of Adhesion and Adhesives
International Journal of Adhesion and Adhesives 工程技术-材料科学:综合
CiteScore
6.90
自引率
8.80%
发文量
200
审稿时长
8.3 months
期刊介绍: The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.
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