Corrosion and wear study of medium entropy Pb-Sn-Cu alloy for coating application

Gokul M. Pillai , Kuldeep Singh , Shanmugasundaram Thangaraju , Shashinath Jha , Vinod Kumar
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Abstract

This study focuses on developing a low-friction coating material using ternary medium entropy alloy using lead (Pb), tin (Sn), and copper (Cu). A Vajra Lep made of Pb-Sn-Cu system reported in Varah Mihir's Jyotish Granth "Brihat-Samhita" inspired this research. The reported alloy in the present study was fabricated via the open induction casting method. The microstructure and phase analysis were conducted using a scanning electron microscope and X-ray diffraction. It revealed that Pb-Sn, Pb-rich, and Cu-Sn stable phases are formed during open induction melting-casting. The average microhardness was measured to be 25.3 ± 13.61 HV, suitable for the coating material. The corrosion tests were performed in 3.5 wt% NaCl medium, which showed the formation of a stable passivation layer. Icorr was determined to be 5.63 × 10−7 A/cm2, confirming that the material has high corrosion resistance compared to SS316. The wear tests were carried out at different temperatures with a constant load of 10 N and sliding velocity of 314 mm/s. The wear rate was noted to be 5.623 × 10−5 mm3/Nm at room temperature and decreased to 2.811 x 10−5 mm3/Nm at 80 ℃, exhibiting comparable wear resistance with that of Babbitt alloys. Hence, the study is meaningful in designing the Pb-Sn-Cu based multicomponent alloy system as a coating material for various applications.
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镀层中熵Pb-Sn-Cu合金的腐蚀磨损研究
本研究的重点是利用铅(Pb)、锡(Sn)和铜(Cu)三元介质熵合金开发一种低摩擦涂层材料。在Varah Mihir的Jyotish Granth“Brihat-Samhita”中报道的由Pb-Sn-Cu系统制成的金刚枕启发了这项研究。本研究所报道的合金是采用开式感应铸造法制备的。采用扫描电子显微镜和x射线衍射对其进行显微组织和物相分析。结果表明,在开式感应熔铸过程中形成了Pb-Sn、富pb和Cu-Sn稳定相。测得的平均显微硬度为25.3 ± 13.61 HV,适合该涂层材料。在3.5 wt% NaCl介质中进行腐蚀试验,发现形成了稳定的钝化层。测定的Icorr为5.63 × 10−7 A/cm2,证实该材料与SS316相比具有更高的耐腐蚀性。在恒定载荷为10 N、滑动速度为314 mm/s的条件下,进行了不同温度下的磨损试验。室温下的磨损率为5.623 × 10−5 mm3/Nm, 80℃时的磨损率为2.811 x 10−5 mm3/Nm,其耐磨性与巴氏合金相当。因此,该研究对于设计出可作为多种应用涂层材料的Pb-Sn-Cu基多组分合金体系具有重要意义。
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