Hendrik Schmidt , Markus Käß , Roland Lichtinger , Moritz Hülsebrock
{"title":"Simulation-based FMEA for the reliability assessment of printed circuit boards","authors":"Hendrik Schmidt , Markus Käß , Roland Lichtinger , Moritz Hülsebrock","doi":"10.1016/j.microrel.2025.115613","DOIUrl":null,"url":null,"abstract":"<div><div>Simulation-based FMEA is presented as a method to estimate the reliability of printed circuit boards at the system level. A numerical simulation of relevant stress variables is combined with fatigue models and a probabilistic FMEA to determine probabilities for system level failure modes. Uncertainties of model parameters are estimated and included in the simulation to provide a comprehensive analysis of system level failure probabilities. A parametric reduced order model is used for the numerical simulation to efficiently perform the calculations with uncertain parameters. The simulation-based FMEA workflow is applied to a test printed circuit board excited by harmonic vibrations.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"166 ","pages":"Article 115613"},"PeriodicalIF":1.9000,"publicationDate":"2025-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000265","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Simulation-based FMEA is presented as a method to estimate the reliability of printed circuit boards at the system level. A numerical simulation of relevant stress variables is combined with fatigue models and a probabilistic FMEA to determine probabilities for system level failure modes. Uncertainties of model parameters are estimated and included in the simulation to provide a comprehensive analysis of system level failure probabilities. A parametric reduced order model is used for the numerical simulation to efficiently perform the calculations with uncertain parameters. The simulation-based FMEA workflow is applied to a test printed circuit board excited by harmonic vibrations.
期刊介绍：
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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