Analysis on moisture-induced stresses in wood cell wall considering periodically graded microstructures

IF 3.4 3区 工程技术 Q1 MECHANICS International Journal of Solids and Structures Pub Date : 2025-02-12 DOI:10.1016/j.ijsolstr.2025.113277
Wenbo Li , Mingyang Chen , Yu Dai , Liao-Liang Ke
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Abstract

The S2 layer of the wood cell wall is essentially a biocomposite reinforced by periodically graded microfibril, the mechanical properties of which are significantly affected by environmental humidity. The function of the periodically graded microstructure of microfibril in regulating moisture-induced stress and strain is still unclear. By developing the shear-lag model, we successfully reveal the stress transfer properties of S2 layers with periodically graded microfibrils at different levels of moisture. We demonstrate that the periodically graded microstructure facilitates the moisture-induced interfacial shear stress to be more evenly distributed over the whole microfibril and significantly reduce the interfacial shear stress at the edges, leading to the postponement of the initiation of interfacial debonding. Besides, we find that the moisture-induced stress is non-monotonic and exists maximum value, due to the fact that the polymers comprising the matrix undergo softening upon water absorption. Meanwhile, the length of the different regions of the microfibril is systematically studied, the results indicate that the interface burden can be reduced by increasing the length of graded regions, and sufficiently long pitch do not affect the magnitude of the interfacial shear stress. Moreover, the microstructure of the periodically graded fibril can effectively reduce the negative effect of debonding. These revealed mechanical mechanisms are conducive to the design of fiber-reinforced composites serving under humid condition.
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来源期刊
CiteScore
6.70
自引率
8.30%
发文量
405
审稿时长
70 days
期刊介绍: The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field. Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.
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