Production of NO in nitrogen-based active screen plasma nitriding devices, a disadvantage or an opportunity?

IF 6.1 2区 材料科学 Q1 MATERIALS SCIENCE, COATINGS & FILMS Surface & Coatings Technology Pub Date : 2025-03-15 Epub Date: 2025-02-10 DOI:10.1016/j.surfcoat.2025.131896
T. Czerwiec , O. Carrivain , M. Masieiro , R. Hugon , C. Cardinaud , T. Belmonte , C. Noël , R.P. Cardoso , G. Marcos
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Abstract

Nitric oxide (NO) can have both negative and positive effects on life. Therefore, it is crucial to control its production and destruction, and plasmas associated with reactive surfaces can effectively serve these functions. In this study, we observed the emission of NO radical using optical emission spectroscopy during nitriding experiments in active screen plasma nitriding (ASPN) with pure nitrogen. This phenomenon can be attributed to the contamination of the nitriding reactor surfaces by water vapor when the reactor is opened to introduce the samples for treatment.
In N2–20% H2 plasmas, the emissions of both NO and iron are very low. However, when the hydrogen supply is cut off, we observed that, after a few minutes, the intensities of the NO and iron emission lines become comparable to those obtained when the plasma is generated in nitrogen alone.
We conducted GDOES and XPS characterizations of the surfaces of samples fixed on the grid and treated in both N2 and N2–10% H2 plasmas under similar contamination conditions. The results showed that the grid is nitrided in the N2-H2 plasma mixture, while no nitriding occurs in pure nitrogen plasma. A substantial quantity of NO-containing compounds (nitrosonium and nitrite or nitrito species) is detected when the treatment is performed solely in nitrogen plasma.
We then discussed the production of NO and proposed a surface reaction between the active nitrogen species generated in the plasma and the iron oxide formed through surface segregation on the grid. This reduction reaction consumes active nitrogen, resulting in no nitriding of the grid. In N2-H2 plasmas, the active hydrogen reduces the oxides formed on the grid, allowing the active nitrogen to facilitate nitriding.
In N2-H2 mixtures, an oxynitride composed of the metallic elements of stainless steel forms on the surface, complicating the sputtering of iron in the compound regime. We also explored the potential for controlling the cleanliness of the plasma nitriding process and the possibility of fixing nitrogen through the production of NO.

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氮基有源屏等离子渗氮装置生产NO是劣势还是机遇?
一氧化氮(NO)对生命既有负面影响,也有积极影响。因此,控制其产生和破坏至关重要,而与反应表面相关的等离子体可以有效地发挥这些功能。在本研究中,我们利用光学发射光谱观察了纯氮活性屏等离子体渗氮(ASPN)过程中NO自由基的发射。这种现象可以归结为当反应器打开以引入样品进行处理时,氮化反应器表面被水蒸气污染。在N2-20% H2等离子体中,NO和铁的排放都很低。然而,当氢气供应被切断时,我们观察到,几分钟后,NO和铁发射线的强度变得与仅在氮气中产生等离子体时的强度相当。我们对固定在网格上并在N2和N2 - 10% H2等离子体中处理的样品表面进行了GDOES和XPS表征。结果表明,在N2-H2混合等离子体中,栅格发生了氮化,而在纯氮等离子体中没有发生氮化。当仅在氮等离子体中进行处理时,可检测到大量含no化合物(亚硝基铵和亚硝酸盐或亚硝酸盐)。然后,我们讨论了NO的产生,并提出了等离子体中产生的活性氮与通过网格表面分离形成的氧化铁之间的表面反应。这种还原反应消耗活性氮,导致电网无氮化。在N2-H2等离子体中,活性氢减少了网格上形成的氧化物,使活性氮促进氮化。在N2-H2混合物中,由不锈钢金属元素组成的氮化氧在表面形成,使铁在化合物体系中的溅射变得复杂。我们还探索了控制等离子体氮化过程清洁度的潜力,以及通过产生NO来固定氮的可能性。
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来源期刊
Surface & Coatings Technology
Surface & Coatings Technology 工程技术-材料科学:膜
CiteScore
10.00
自引率
11.10%
发文量
921
审稿时长
19 days
期刊介绍: Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance: A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.
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