Imaging of inclusions in concrete with enhanced low-frequency ultrasound tomography

IF 4.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Sensors and Actuators A-physical Pub Date : 2025-05-01 Epub Date: 2025-02-18 DOI:10.1016/j.sna.2025.116324
Lu Zhang , Chong Qiao , Shangda Jia , Jiajun Zeng , Hongyu Li , Tonghao Zhang , Shengfa Wu
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Abstract

Ultrasonic Testing (UT) is widely used to identify surface and sub-surface defects/flaws in various materials. Especially for a concrete structure, the visualization of the interior using ultrasound tomography allows for the quantitative description of defects. However, imaging error errors in concrete are inevitable due to the nature of ray-trace-based tomography and material, whose detectability can be influenced by many factors (e.g., wave propagation, the existence of aggregates, pores, heterogeneity, etc.). In order to enhance the imaging quality, a proper selection of abnormal path imaging methods based on the average ultrasonic velocity is proposed. The defective and imperfect zones in concrete can be identified by plotting intersection zones formed with multiple paths of ultrasound propagation. To illustrate the proposed strategy, both numerical and experimental analyses were conducted; furthermore, the reliability and efficiency have been confirmed accordingly. Compared with the conventional tomography method, the path optimization imaging method can effectively enhance the detectability and reduce the deployment of transducers and the number of measurements. In addition, an optimization method for determining the time of flight (TOF) is presented to obtain a more accurate arrival time for each ultrasound path with a noise outlier-based method. Low-frequency ultrasonic testing schemes were proposed to ensure sufficient ultrasonic energy penetration and reduce signal attenuation. This work offers a practical solution for high-quality ultrasonic imaging in concrete and further provides an idea for cost-effective and in-situ evaluations.
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增强低频超声层析成像混凝土中夹杂物
超声检测(UT)广泛用于识别各种材料的表面和亚表面缺陷/缺陷。特别是对于混凝土结构,使用超声断层扫描的内部可视化允许对缺陷进行定量描述。然而,由于基于射线迹线的层析成像和材料的性质,混凝土中的成像误差是不可避免的,其可探测性受到许多因素的影响(例如,波的传播,聚集体的存在,孔隙,非均质性等)。为了提高成像质量,提出了基于超声平均速度的异常路径成像方法的合理选择。通过绘制多路径超声传播形成的相交区域,可以识别混凝土中的缺陷区和不完善区。为了说明所提出的策略,进行了数值和实验分析;进一步验证了该方法的可靠性和有效性。与传统的层析成像方法相比,路径优化成像方法可以有效地提高可探测性,减少传感器的部署和测量次数。此外,提出了一种确定飞行时间(TOF)的优化方法,利用基于噪声离群值的方法获得每条超声路径更精确的到达时间。提出了低频超声检测方案,以保证超声能量的充分穿透,减少信号衰减。这项工作为高质量的混凝土超声成像提供了实用的解决方案,并进一步为成本效益和原位评估提供了思路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Sensors and Actuators A-physical
Sensors and Actuators A-physical 工程技术-工程:电子与电气
CiteScore
8.10
自引率
6.50%
发文量
630
审稿时长
49 days
期刊介绍: Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...
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