Numerical simulation of temperature and stress field distribution during the rapid quenching process of hollow glass microspheres

Abstract

Hollow glass microspheres (HGMs) are lightweight fillers with significant potential in various applications, including oil drilling, deep-sea exploration, and aerospace. This study introduces a mathematical model with adaptive thermal boundary conditions to examine the effects of cooling medium, particle size, and wall thickness on the temperature gradient and residual stress distribution in HGMs. Results indicate that using water as a quenching medium results in the fastest cooling rates and the highest residual stress. HGMs are rapidly quenched when using water as the cooling medium, resulting in a compressive strength range of approximately 30–53 %. Smaller particle sizes and thicker walls positively affect compressive strength by improving heat dissipation and increasing the temperature gradient within the material. However, non-uniform wall thickness of individual HGMs induces stress concentration, significantly weakening material strength. Therefore, optimizing heating and cooling rates, while ensuring uniform particle characteristics, is crucial for improving the durability and performance of HGMs.