Frequency analysis of flow and heat transfer near reattachment point behind a backward-facing step

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL International Journal of Heat and Fluid Flow Pub Date : 2025-02-27 DOI:10.1016/j.ijheatfluidflow.2025.109771
Shunsuke Yamada, Yuki Funami, Hajime Nakamura
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Abstract

In this study, the nature of the flow and heat transfer near the flow reattachment point behind a backward-facing step was experimentally investigated at a Reynolds number of 5400. The unsteady fluctuations of the velocity and temperature were simultaneously measured by particle image velocimetry in a two-dimensional plane that contained three components (2D-3C PIV) and by high-speed infrared thermography. To evaluate the mechanism of the flow and heat transfer, the vorticity and heat transfer coefficients were calculated from the time history data for each velocity and temperature. Also, the spatial flow structure and the characteristic frequency of the flow and heat transfer fluctuations were investigated by using two-point correlation, a fast Fourier transform, and a continuous wavelet transform. These results showed that the characteristic frequencies for each velocity and heat transfer coefficient appeared near the wall. It was revealed that the temporal and spatial fluctuations of the heat transfer coefficient corresponded to that of the streamwise flow. From the time-moving averaging streamwise velocity and heat transfer with the conditional sampling, the zero-velocity line at the low nondimensional frequency of 0.06 fluctuated near the wall as time advance, and the high heat transfer appeared near the instantaneous reattachment point.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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