Electrochemical oxidation and corrosion behavior of 3D printed reaction-bonded silicon carbide ceramics in eco-friendly electrolyte

IF 5.6 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS Ceramics International Pub Date : 2025-03-01 Epub Date: 2024-12-20 DOI:10.1016/j.ceramint.2024.12.330
Chenxin Li , Yong Liu , Kan Wang , Yipeng Qin , Xiaotong Wu
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Abstract

3D printed reaction-bonded silicon carbide (RBSiC) is widely employed across various industries due to its complex geometries and exceptional properties. However, its precise machining remains a significant challenge. Electrochemical grinding (ECG) presents a promising solution for the precise machining of RBSiC. Still, further optimization of the process is still required. In this study, we investigate the electrochemical oxidation and corrosion behavior of 3D printed RBSiC in an eco-friendly KH2PO4 electrolyte, characterize its microstructure and phases composition, and developed a predictive model for the thickness of the oxidation layer. Experimental results show that the oxidation process of RBSiC, influenced by free silicon, is intricate and segmented, involving the oxidation of Si and SiC as well as Si over-passivation under high voltage. SEM reveals that the oxide film thickness ranges from 1.57 μm to 15.5 μm. EIS and microstructural analysis identify micro defects filled with electrolyte in the oxide layer at high voltage, causing the dielectric constant to surge to 19.65—a nearly 500 % increase. Thus, this study calibrates oxidation current efficiency (η) and the real dielectric constant (εra) of RBSiC in KH2PO4 electrolyte, leading to the development of a three-stage predictive model that matching with the observed oxide film growth trends. These findings provide a theoretical framework and empirical data for optimizing ECG processing of RBSiC.
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3D打印反应键合碳化硅陶瓷在环保电解质中的电化学氧化和腐蚀行为
3D打印反应键合碳化硅(RBSiC)由于其复杂的几何形状和卓越的性能而广泛应用于各个行业。然而,其精密加工仍然是一个重大挑战。电化学磨削(ECG)为RBSiC的精密加工提供了一种有前途的解决方案。不过,这一过程仍需进一步优化。在这项研究中,我们研究了3D打印RBSiC在环保型KH2PO4电解质中的电化学氧化和腐蚀行为,表征了其微观结构和相组成,并建立了氧化层厚度的预测模型。实验结果表明,受游离硅的影响,RBSiC的氧化过程是复杂的、分节的,包括Si和SiC的氧化以及高压下Si的过钝化。扫描电镜显示,氧化膜厚度在1.57 ~ 15.5 μm之间。EIS和微观结构分析发现,在高压下,氧化层中充满电解质的微缺陷导致介电常数激增至19.65,增加了近500%。因此,本研究校准了氧化电流效率(η)和RBSiC在KH2PO4电解质中的实际介电常数(εra),从而建立了一个与观察到的氧化膜生长趋势相匹配的三阶段预测模型。这些研究结果为优化RBSiC心电处理提供了理论框架和经验数据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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