{"title":"An accurate non-uniformity characterization of the temperature field in microsystems based on singular value decomposition","authors":"Yanrong Pei , Wenchang Li , Jian Liu","doi":"10.1016/j.mejo.2025.106619","DOIUrl":null,"url":null,"abstract":"<div><div>The significant thermal challenges faced by the new generation of high-density integrated microsystems have become hot research topics in current thermal design, management, and reliability of microsystems. The non-uniformity of temperature field (NUTF) is at the core of these challenges. Accurately characterizing the NUTF of microsystems has been a difficult task. This paper proposes an accurate characterization method for microsystem NUTF based on singular value decomposition (SVD) to enhance the effectiveness and accuracy of traditional NUTF characterization methods. The paper also investigates the impact of the non-uniform distribution of the microsystem's heat flux densities (HFDs) on the temperature field and its complexity using the singular value properties. The results demonstrate that the proposed method can quantitatively characterize the steady-state NUTF and the spatial-temporal transient NUTF of the microsystems. The decay rate of the singular values can effectively identify the non-uniformity of the microsystem's HFDs. The number of singular values above a threshold can quantitatively assess the complexity of the microsystem temperature field.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"158 ","pages":"Article 106619"},"PeriodicalIF":1.9000,"publicationDate":"2025-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125000682","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The significant thermal challenges faced by the new generation of high-density integrated microsystems have become hot research topics in current thermal design, management, and reliability of microsystems. The non-uniformity of temperature field (NUTF) is at the core of these challenges. Accurately characterizing the NUTF of microsystems has been a difficult task. This paper proposes an accurate characterization method for microsystem NUTF based on singular value decomposition (SVD) to enhance the effectiveness and accuracy of traditional NUTF characterization methods. The paper also investigates the impact of the non-uniform distribution of the microsystem's heat flux densities (HFDs) on the temperature field and its complexity using the singular value properties. The results demonstrate that the proposed method can quantitatively characterize the steady-state NUTF and the spatial-temporal transient NUTF of the microsystems. The decay rate of the singular values can effectively identify the non-uniformity of the microsystem's HFDs. The number of singular values above a threshold can quantitatively assess the complexity of the microsystem temperature field.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.