An accurate non-uniformity characterization of the temperature field in microsystems based on singular value decomposition

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2025-02-27 DOI:10.1016/j.mejo.2025.106619
Yanrong Pei , Wenchang Li , Jian Liu
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Abstract

The significant thermal challenges faced by the new generation of high-density integrated microsystems have become hot research topics in current thermal design, management, and reliability of microsystems. The non-uniformity of temperature field (NUTF) is at the core of these challenges. Accurately characterizing the NUTF of microsystems has been a difficult task. This paper proposes an accurate characterization method for microsystem NUTF based on singular value decomposition (SVD) to enhance the effectiveness and accuracy of traditional NUTF characterization methods. The paper also investigates the impact of the non-uniform distribution of the microsystem's heat flux densities (HFDs) on the temperature field and its complexity using the singular value properties. The results demonstrate that the proposed method can quantitatively characterize the steady-state NUTF and the spatial-temporal transient NUTF of the microsystems. The decay rate of the singular values can effectively identify the non-uniformity of the microsystem's HFDs. The number of singular values above a threshold can quantitatively assess the complexity of the microsystem temperature field.
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新一代高密度集成微系统所面临的重大热挑战已成为当前微系统热设计、管理和可靠性方面的热门研究课题。温度场不均匀性(NUTF)是这些挑战的核心。准确表征微系统的非均匀温度场一直是一项艰巨的任务。本文提出了一种基于奇异值分解(SVD)的微系统 NUTF 精确表征方法,以提高传统 NUTF 表征方法的有效性和准确性。本文还利用奇异值特性研究了微系统热通量密度(HFD)的非均匀分布对温度场及其复杂性的影响。结果表明,所提出的方法可以定量表征微系统的稳态 NUTF 和时空瞬态 NUTF。奇异值的衰减率可以有效识别微系统高频分解的不均匀性。超过阈值的奇异值数量可以定量评估微系统温度场的复杂性。
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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