Li Zhu, Guangya Li, Weixia Dong, Jianyang Zhang, Yuemin Ma, Haiyan He, Si Lan, Zhenduo Wu, Xiaohu Li, Tao Yang, Xun-Li Wang
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引用次数: 0
Abstract
Grain refinement is an effective approach to tailoring the deformation mechanism and thus the mechanical properties of a material. In this study, the deformation behaviors of the CrCoNi medium entropy alloy with different grain sizes were investigated by in-situ neutron diffraction and transmission electron microscopy observations. For the coarse-grained CrCoNi alloy, the initial plastic deformation was driven by dislocation slip, while stacking faults and twinning became activated at a later stage. The critical stress for stacking faults in coarse-grained samples exhibited a weaker grain size sensitivity than that of dislocation slip. As a result, below a grain size threshold, the critical stress needed to trigger the dislocation slip caught up with that of stacking faults. It was shown that for CrCoNi, when the grain size was below ∼1.5 μm, all the three deformation modes, namely, dislocation slip, stacking faults, and twinning, were activated simultaneously, which resulted in a grain-size dependence deviating from the Hall-Petch relationship due to the extra strengthening at yielding. The contributions from dislocations and planar faults to the work hardening were quantified, which revealed a dominant role of dislocations in the hardening behaviors of the CrCoNi alloy. However, the relative magnitude of these contributions changed as the grain size was reduced, with the contribution from planar faults, especially the stacking faults, becoming increasingly significant.
期刊介绍:
Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.