(Ca1 − x Mx)V2O6 (M = Zn, Ba) ultra-low temperature co-firable ceramics for microwave power divider applications

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-03-08 DOI:10.1007/s10854-025-14487-7
B. Masin, K. Ashok, Manoj Joseph, L. Yerrinaidu, K. Jalaja, Femina Beegum, K. Prabhakaran, H. Sreemoolanadhan
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Abstract

The effects of substituting Zn2+ and Ba2+ for Ca2+ on the crystal structure, sintering temperature, microstructure, and microwave dielectric properties of (Ca1 − x Mx)VO6 (M = Zn, Ba) [x = 0.025–0.10] have been studied. X-ray diffraction, along with refinement results, indicate that all the samples had a monoclinic crystal structure with C2/m space group, and the cationic substitutions affect the cell volume of the ceramics while retaining the crystal structure. Both Zn2+ and Ba2+ at Ca2+ in small percentages improved the density and dielectric properties. The (Ca0.95 Zn0.05)V2O6 ceramic sintered at 650 °C achieved εr = 10.6, Q × f = 42,400 GHz and τf =  − 60 ppm/°C, while the (Ca0.95 Ba0.05)V2O6 ceramic sintered at 600 °C showed εr = 10.1, Q × f = 46,100 GHz, and τf =  − 59 ppm/°C. All the (Ca1 − x Mx) VO6 ceramics exhibited a negative value of τf. The chemical compatibility with metal electrode was investigated by cofiring both ceramics with Aluminium (Al) metal at the optimised sintering temperature. XRD and EDS analysis confirmed the non-existence of reaction between ceramic and metal and formation of any other secondary phases, indicating significant potential of the ceramics for use in ULTCC applications. Furthermore, a 2-section Wilkinson power divider operating in the L band has been designed and fabricated onto the ULTCC ceramic by screen printing techniques using low temperature curable silver epoxy paste. The fabricated power divider showed a maximum insertion loss of 4.8 dB and a minimum isolation of 14 dB in 1–1.7 GHz matching with the simulation.

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Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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