S-ANN: Synchronous TCAD device simulation of FinFET using Artificial Neural Network

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2025-03-05 DOI:10.1016/j.mejo.2025.106630
Yansen Liu , Xiaonian Liu , Ying Zhou , Peng Cao
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Abstract

The Fin Field-Effect Transistor (FinFET) plays a crucial role in integrated circuits due to its superior control capabilities and low leakage current. However, its complex structure often leads to substantial computational demands and significant time consumption during Technology Computer-Aided Design (TCAD) simulations. To address these challenges, we innovatively propose a synchronous TCAD device simulation model based on Artificial Neural Network (ANN) for FinFET at advanced technology nodes, abbreviated as S-ANN. This model systematically extracts FinFET characteristics under various physical sizes and bias conditions from TCAD simulations and further analyzes transient response data contained in TDR files to build a training dataset, thereby enabling effective training of the S-ANN model. Through rigorous testing and evaluation, S-ANN has demonstrated high compatibility with Sentaurus TCAD and the capability to accurately simulate TCAD electrical characteristics. In addition, Nanosheet FET was used to verified the generalization capability of the S-ANN model. Compared to traditional TCAD simulations, the S-ANN model significantly reduces both computational resource usage and simulation time, while effectively overcoming convergence problems. This advancement offers strong support for the rapid design and optimization of advanced semiconductor devices.
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S-ANN:基于人工神经网络的FinFET同步TCAD器件仿真
翅片场效应晶体管(FinFET)由于其优越的控制能力和低漏电流在集成电路中起着至关重要的作用。然而,在技术计算机辅助设计(TCAD)仿真中,其复杂的结构往往导致大量的计算量和大量的时间消耗。为了解决这些挑战,我们创新地提出了一种基于先进技术节点的FinFET人工神经网络(ANN)的同步TCAD器件仿真模型,简称S-ANN。该模型系统地从TCAD仿真中提取各种物理尺寸和偏置条件下的FinFET特性,并进一步分析TDR文件中包含的瞬态响应数据,构建训练数据集,从而实现S-ANN模型的有效训练。经过严格的测试和评估,S-ANN已经证明了与Sentaurus TCAD的高度兼容性,以及精确模拟TCAD电气特性的能力。此外,利用纳米片场效应晶体管验证了S-ANN模型的泛化能力。与传统的TCAD仿真相比,S-ANN模型在有效克服收敛问题的同时,大大减少了计算资源的使用和仿真时间。这一进步为先进半导体器件的快速设计和优化提供了强有力的支持。
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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