{"title":"S-ANN: Synchronous TCAD device simulation of FinFET using Artificial Neural Network","authors":"Yansen Liu , Xiaonian Liu , Ying Zhou , Peng Cao","doi":"10.1016/j.mejo.2025.106630","DOIUrl":null,"url":null,"abstract":"<div><div>The Fin Field-Effect Transistor (FinFET) plays a crucial role in integrated circuits due to its superior control capabilities and low leakage current. However, its complex structure often leads to substantial computational demands and significant time consumption during Technology Computer-Aided Design (TCAD) simulations. To address these challenges, we innovatively propose a synchronous TCAD device simulation model based on Artificial Neural Network (ANN) for FinFET at advanced technology nodes, abbreviated as S-ANN. This model systematically extracts FinFET characteristics under various physical sizes and bias conditions from TCAD simulations and further analyzes transient response data contained in TDR files to build a training dataset, thereby enabling effective training of the S-ANN model. Through rigorous testing and evaluation, S-ANN has demonstrated high compatibility with Sentaurus TCAD and the capability to accurately simulate TCAD electrical characteristics. In addition, Nanosheet FET was used to verified the generalization capability of the S-ANN model. Compared to traditional TCAD simulations, the S-ANN model significantly reduces both computational resource usage and simulation time, while effectively overcoming convergence problems. This advancement offers strong support for the rapid design and optimization of advanced semiconductor devices.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"159 ","pages":"Article 106630"},"PeriodicalIF":1.9000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125000797","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The Fin Field-Effect Transistor (FinFET) plays a crucial role in integrated circuits due to its superior control capabilities and low leakage current. However, its complex structure often leads to substantial computational demands and significant time consumption during Technology Computer-Aided Design (TCAD) simulations. To address these challenges, we innovatively propose a synchronous TCAD device simulation model based on Artificial Neural Network (ANN) for FinFET at advanced technology nodes, abbreviated as S-ANN. This model systematically extracts FinFET characteristics under various physical sizes and bias conditions from TCAD simulations and further analyzes transient response data contained in TDR files to build a training dataset, thereby enabling effective training of the S-ANN model. Through rigorous testing and evaluation, S-ANN has demonstrated high compatibility with Sentaurus TCAD and the capability to accurately simulate TCAD electrical characteristics. In addition, Nanosheet FET was used to verified the generalization capability of the S-ANN model. Compared to traditional TCAD simulations, the S-ANN model significantly reduces both computational resource usage and simulation time, while effectively overcoming convergence problems. This advancement offers strong support for the rapid design and optimization of advanced semiconductor devices.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.