Overcoming the uniform heat transfer network construction trade-off in anchored structure composites with electromagnetic shielding performance

Abstract

The development of high-performance thermal conductivity (TC) and electromagnetic interference (EMI) shielding composites is crucial in advancing technologies like AI and 5G, as these materials are key to managing heat and protecting against EMI in modern electronic devices. In this work, we present an anchored structure polyetheretherketone (PEEK) composite consisting of a lattice structure MWCNTs/PEEK and with a core-shell structure (NH₂-GnPs@Ag&MWCNTs)@PBZ/PEEK particles confined within the lattice and fabricated by laminate processing. This unique configuration establishes dual transport pathways for both phonons and electrons, creating a more robust and homogeneous thermal conduction network compared to conventional segregated structures, while maintaining effective charge carrier transport. The anchored structure composites with 14.13 % filler content achieved TC optimums of 4.36 W m⁻¹K⁻¹ in-plane and 2.71 W m⁻¹K⁻¹ through plane, which are 1178 % and 1896 % better than those of pure PEEK. The dense anchored structure network, polybenzoxazine (PBZ) interfacial modification, and the heterostructure NH₂-GnPs@Ag work synergistically to enhance the efficient transport of phonons and electrons while reducing interfacial thermal resistance (ITR). Furthermore, the anchored structure composites demonstrate outstanding EMI shielding capability (59.05 dB, 14.13 %), thermal stability, and thermal management performance. Finite element modeling further confirms that the anchored structure promotes phonon/electron transport and effectively attenuates EMI waves.